Semiconductor Module Support Structure for Screw Mounting Stress
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Solution Overview
Problem
Semiconductor modules can be damaged when attached to a heat dissipation plate with screws, particularly due to stress concentration at the center portion, leading to cracks and potential damage to internal components.
Innovation Solution
A semiconductor module design featuring rear surface supporting portions protruding from the sealed main body, positioned between attachment holes, which stabilize the module during screw attachment, preventing lifting and stress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the semiconductor module is attached to the heat dissipation plate with screws, then the module can be securely fixed, but stress concentration occurs at the center portion causing cracks and damage
Solution Approach 1:
The attachment structure is segmented into multiple support points: rear surface supporting portions at the attachment hole locations and front surface supporting portions between the attachment holes. This segmentation distributes the attachment stress across multiple discrete points rather than concentrating it at the center, preventing crack formation while maintaining secure fixation.
Solution Approach 2:
The front surface supporting portions act as intermediary elements between the attachment holes and the center portion of the semiconductor module. These intermediate support structures prevent direct stress transmission from the screw attachment points to the vulnerable center region, thereby protecting the module integrity while maintaining attachment strength.
2Ease of operation
If one side of the semiconductor module is screwed first, then attachment can be performed sequentially, but the other side gets lifted causing stress concentration
Solution Approach 1:
The front surface supporting portions are pre-formed on the semiconductor module before the attachment process. This preliminary structural preparation ensures that when screws are attached to one side, the front surface support portions prevent lifting of the opposite side, maintaining module stability throughout the sequential attachment process.
Solution Approach 2:
Different regions of the semiconductor module are given different structural qualities: the rear surface has supporting portions at the attachment hole locations for secure fixation, while the front surface has supporting portions between the attachment holes to prevent lifting. This local differentiation of structural properties allows sequential attachment without stability issues.
Data Source
AI summary
A semiconductor module, including a semiconductor chip, a sealed main body portion sealing the semiconductor chip and having a pair of attachment holes penetrating therethrough, a heat dissipation plate in contact with the sealed main body portion. The heat dissipation plate is positioned between the attachment holes in a plan view of the semiconductor module. The semiconductor module further includes a pair of rear surface supporting portions and/or a pair of front surface supporting portions protruding respectively from rear and front surfaces of the sealed main body portion. In the plan view, the heat dissipation plate is formed between the pair of attachment holes, which are in turn between the pair of rear surface supporting portions. The pair of front surface supporting portions are formed substantially between the pair of attachment holes in the plan view.