Semiconductor Module PCB Terminal Assembly for Press-Fit Layouts
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Solution Overview
Problem
Conventional semiconductor modules with molded packages have difficulty in freely laying out external terminals and employing special terminal shapes due to their prismatic structure, limiting their application in systems requiring press-fit terminals.
Innovation Solution
A semiconductor module design that includes a molded package sealed with transfer molding resin, featuring a package assembly with a printed circuit board connected to a package terminal, allowing for the use of press-fit terminals and other shapes, and enabling flexible terminal layouts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a molded package with a prismatic terminal structure is used, then the package can be manufactured with standard molding processes, but the external terminal cannot be freely laid out or shaped for press-fit applications
Solution Approach 1:
The package structure is divided into two independent parts: the molded package containing the semiconductor chip, and a separate package assembly containing the external terminal. This segmentation allows each part to be optimized independently - the molded package for manufacturing efficiency and the package assembly for terminal layout flexibility and press-fit compatibility.
Solution Approach 2:
A package assembly is introduced as an intermediary component between the molded package and the external terminal. This intermediary structure enables flexible terminal layouts and press-fit configurations without modifying the standard molded package manufacturing process, thus resolving the contradiction between adaptability and device complexity.
2Ease of manufacture
If a prismatic terminal shape is used in molded packages, then the manufacturing process is simplified, but special terminal shapes such as press-fit terminals cannot be employed
Solution Approach 1:
The terminal system is segmented into the molded package terminal and the separate package assembly terminal. The molded package maintains its simple prismatic terminal for easy manufacturing, while the package assembly provides the specialized terminal shape (e.g., press-fit) needed for specific applications, thus resolving the contradiction between manufacturing ease and shape variety.
Solution Approach 2:
The package assembly acts as an intermediary that transforms the simple prismatic terminal from the molded package into a specialized terminal shape suitable for press-fit applications. This intermediary structure enables special terminal shapes without complicating the molded package manufacturing process.
3Volume of moving object
If the package size is downsized, then the module becomes more compact, but maintaining reliability and insulation becomes more difficult
Solution Approach 1:
The package assembly extends the terminal structure in a direction perpendicular to the molded package surface, utilizing the vertical dimension to maintain adequate insulation distances even when the horizontal package size is reduced. This dimensional transition allows compact packaging while preserving electrical insulation reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of press-fit terminals and other shapes, enhances layout flexibility, reduces material costs, and increases productivity while maintaining reliability and insulation, even in downsized packages.
Implementation Method 1
a molded package in which a semiconductor chip is sealed with transfer molding resin
Data Source
AI summary
A molded package in which a semiconductor chip is sealed with transfer molding resin, and a package assembly attached to a package terminal projecting from a package side surface of the molded package are included. The package assembly includes a printed circuit board that is physically and electrically connected to the package terminal, and an external terminal mounted on the printed circuit board and electrically connected to the package terminal.