Power Semiconductor Module Lead Frame Terminal Configuration
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Solution Overview
Problem
Conventional power semiconductor module packaging methods often result in terminal coupling faults due to uneven pressure application, leading to costly and time-consuming subsequent processing steps before faults are discovered.
Innovation Solution
A power semiconductor module design with a lead frame featuring reduced terminal numbers and a Direct Bonded Copper (DBC) substrate with specific metal pattern configurations, allowing for earlier detection of coupling faults through wire bonding and testing, thereby minimizing production waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pressure is applied to bond multiple terminals to a DBC substrate, then bonding speed is improved, but bonding precision deteriorates due to uneven pressure distribution
Solution Approach 1:
The patent divides the bonding process into two stages: first bonding a reference terminal with precise positioning, then bonding remaining terminals using the reference terminal as a positioning基准. This segmentation allows high-speed parallel bonding of multiple terminals while maintaining precision through the reference terminal guidance.
Solution Approach 2:
The reference terminal serves as an intermediary element that mediates between the bonding pressure application and the positioning requirements. By establishing the reference terminal first, it creates a stable reference point that enables subsequent terminals to be bonded accurately without requiring perfectly uniform pressure distribution across all terminals simultaneously.
2Productivity
If multiple terminals are bonded simultaneously to a DBC substrate, then manufacturing efficiency is improved, but fault detection is delayed until final testing
Solution Approach 1:
The patent performs preliminary bonding of a reference terminal before bonding other terminals. This preliminary action creates a reference structure that enables subsequent terminals to be bonded with proper positioning. More importantly, it allows for intermediate inspection points where bonding quality can be verified before completing the entire assembly, enabling earlier fault detection.
Solution Approach 2:
The reference terminal bonding process establishes a feedback mechanism where the positioning and bonding quality of the reference terminal can be measured and used to adjust subsequent bonding parameters. This feedback loop enables real-time quality control during the manufacturing process rather than only at the final testing stage.
3Manufacturing precision
If a reference terminal is established before bonding other terminals, then bonding precision is improved, but the number of bonding steps increases
Solution Approach 1:
The reference terminal serves multiple functions: it acts as a positioning reference for subsequent terminals, provides a quality benchmark for bonding process verification, and can itself be a functional terminal in the final product. This multi-functionality justifies the additional initial step by eliminating the need for separate positioning fixtures or reference structures.
Solution Approach 2:
The reference terminal enables the bonding process to be self-positioning and self-verifying. Once the reference terminal is established, subsequent terminals use it as their positioning reference, making the system self-sufficient without requiring external positioning equipment. The process essentially bonds itself with high precision through the reference terminal mechanism.
Data Source
AI summary
A power semiconductor module includes: a substrate including first, second, and third metal patterns separated from each other, a semiconductor element located on the substrate, a lead frame located on the substrate and including first, second, third, and fourth bodies; a first terminal connected to the first body, a second terminal connected to the second body, and a third common terminal that connects the third body and the fourth body, wherein a length of the third common terminal is longer than that of the first and second terminals.