Semiconductor Module Terminal Arrangement for Creepage Distance
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Solution Overview
Problem
The semiconductor module disclosed in prior art faces difficulties in securing a sufficient creepage distance between the P-phase and N-phase terminals, which can lead to electrical short circuits.
Innovation Solution
The semiconductor module incorporates a pair of switching devices and their respective drive circuits, sealed in a rectangular package, with the P-phase and N-phase terminals arranged to protrude from opposite sides, ensuring a secure creepage distance through strategic terminal placement and configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the P-phase terminal and N-phase terminal are arranged side by side on the same side of the module package, then the device complexity is reduced and mounting is simplified, but the creepage distance between terminals cannot be secured
Solution Approach 1:
The patent transitions from arranging terminals on the same side (2D planar arrangement) to arranging them on opposite sides of the package (spatial distribution across multiple dimensions). This dimensional change allows the terminals to be separated by the entire package width, securing the required creepage distance while maintaining a compact footprint.
Solution Approach 2:
The patent divides the terminal arrangement into distinct groups located at different spatial locations - P-phase terminals on one side and N-phase terminals on the opposite side. This segmentation physically separates high-potential and low-potential terminals, ensuring electrical isolation through the package structure while simplifying the overall design.
2Reliability
If the terminals are arranged to secure sufficient creepage distance, then electrical reliability is improved, but the mounting process becomes more complex
Solution Approach 1:
The patent employs asymmetric terminal arrangement where P-phase and N-phase terminals are positioned on opposite sides of the rectangular package rather than symmetrically on the same side. This asymmetric configuration naturally provides creepage distance through the package structure while maintaining clear identification and simplified mounting procedures.
Data Source
AI summary
The present invention is a semiconductor module including: first and second drive circuits that perform drive control of at least one pair of first and second switching devices, in which the at least one pair of first and second switching devices and the first and second drive circuits are sealed in a package having a rectangular shape in plan view, and there are provided: a control terminal provided to protrude from a side surface of a first long side out of first and second long sides of the package, and to which a control signal of the first and second drive circuits is inputted; an output terminal provided to protrude from a side surface of the second long side; a first main terminal provided to protrude from a side surface of a first short side out of first and second short sides of the package; and a second main terminal provided to protrude from a side surface of the second short side.