Semiconductor Module Terminal Layout for Smaller Package Footprint
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Solution Overview
Problem
There is a demand for energy-saving, sophisticated, and smaller electronic devices, necessitating improvements in the performance and size reduction of semiconductor modules.
Innovation Solution
A semiconductor module configuration featuring a conductive substrate with a semiconductor element bonded to its obverse surface, a control terminal protruding along the thickness direction, and covered by a sealing resin, which extends to cover the conductive substrate and part of the control terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor module structures are used, then manufacturing and assembly are straightforward, but the module size cannot be sufficiently reduced
Solution Approach 1:
The control terminal is configured to extend in the thickness direction (vertical dimension) rather than only in the planar direction, utilizing the third dimension to reduce planar footprint and overall module size while maintaining electrical connectivity and control functionality
Solution Approach 2:
The control terminal is embedded within the sealing resin structure, with the terminal nested inside the resin body and only the tip protruding outward. This nesting approach consolidates multiple components (terminal, resin, mounting structure) into a compact integrated unit, reducing overall module volume
2Ease of operation
If the control terminal is extended in the planar direction, then connection is easier, but the module width increases
Solution Approach 1:
The control terminal transitions from a planar extension to a vertical extension in the thickness direction, enabling connection operations to occur in the vertical dimension rather than requiring increased planar width, thus reducing module footprint while maintaining connectability
3Reliability
If the sealing resin covers the entire control terminal, then protection is improved, but the control terminal cannot protrude for connection
Solution Approach 1:
The sealing resin provides comprehensive protection to the control terminal body while deliberately leaving the tip portion exposed. This localized differentiation ensures that the majority of the terminal is protected within the resin for reliability, while the tip remains accessible for electrical connection, achieving both protection and operability
Data Source
AI summary
A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.