Semiconductor Module Usability Prediction via Thermal Resistance

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Solution Overview

Problem

Current methods for determining the remaining usability of semiconductor modules are inaccurate due to their failure to account for changes in thermal resistance and small temperature rises, leading to premature maintenance and increased costs.

Innovation Solution

Sensing the temperature of semiconductor elements or determining thermal resistance between the semiconductor module and the cooling device, comparing these values to reference points to predict the remaining usability, allowing for more accurate assessment of the module's end of life.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If current methods are used to determine remaining usability of semiconductor modules, then maintenance can be performed, but the prediction accuracy is poor leading to premature maintenance

Engineering Contradiction:

Improveprediction accuracy of remaining usabilityVSAvoidpremature maintenance timing

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

The patent changes the measurement parameter from generic temperature monitoring to specific thermal resistance measurement between the semiconductor element and cooling device. By measuring thermal resistance (θjc) and comparing it to initial values, the system achieves more accurate prediction of remaining usability without causing premature maintenance.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent replaces mechanical/invasive measurement methods with electrical measurement techniques. Thermal resistance is determined through electrical measurements (voltage and current) during normal operation, avoiding the need for physical disassembly or intrusive sensors that could affect the semiconductor module.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Measurement precision

If thermal resistance determination is implemented, then prediction accuracy improves, but measurement and evaluation complexity increases

Engineering Contradiction:

Improveremaining usability prediction accuracyVSAvoidmeasurement and evaluation system complexity

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The semiconductor module performs self-diagnosis by utilizing its own operational parameters (voltage, current, temperature) to determine thermal resistance. The module monitors its own thermal characteristics during normal operation without requiring external testing equipment or additional measurement infrastructure.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The measurement system serves multiple functions: it monitors thermal resistance for usability prediction, tracks temperature during operation, and evaluates degradation trends. The same measurement infrastructure supports both operational monitoring and predictive maintenance functions.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Measurement precision

If continuous monitoring is performed to improve prediction accuracy, then remaining usability can be determined more precisely, but energy consumption and operational costs increase

Engineering Contradiction:

Improveremaining usability determination precisionVSAvoidenergy consumption for monitoring

Core Design Contradiction:

Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The thermal resistance measurement is performed continuously during normal operation using the same voltage and current signals that power the semiconductor module. The measurement utilizes existing operational signals rather than requiring separate dedicated measurement signals, thereby eliminating additional energy consumption.

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach provides a more precise prediction of semiconductor module usability, enabling timely maintenance and reducing operational and maintenance costs by accurately determining the remaining life of the module.

Implementation Method 1

a semiconductor element (28) which is thermally coupled to a cooling device (20)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11480607B2Determining the remaining usability of a semiconductor module in normal use

Publication Date: 2022.10.25 SIEMENS AG

AI summary

A method for determining the remaining usability of a semiconductor module in normal use. The semiconductor module is thermally coupled to a cooling device. A predefined electrical load is applied to the semiconductor module while predefined cooling is effected by the cooling device. A temperature of a semiconductor element of the semiconductor module is sensed at least for the predefined electrical load on the semiconductor module. The sensed temperature is compared with a comparison temperature in a first comparison. The comparison temperature is assigned to the predefined electrical load with the predefined cooling, and prediction data for the remaining usability of the semiconductor module in normal use up to a usability end are determined at least in accordance with the first comparison.