Power Semiconductor Module with Embedded Thick Conductor Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Modern power semiconductor modules face challenges with complex construction requiring multiple soldering connections, leading to electrical contact resistance and heat dissipation issues, particularly as power density increases.
Innovation Solution
A power semiconductor module design featuring a first printed circuit board with a thick conductor layer embedded in an insulation carrier, allowing for high current transfer and eliminating the need for external terminal pins, and incorporating dual heat sinks for efficient cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple soldering connections are used to connect components, then electrical connections can be established, but electrical contact resistance increases and reliability decreases
Solution Approach 1:
The patent merges the terminal pin function and the connection function into a single integrated structure. The printed circuit board directly provides both mechanical support and electrical connection, eliminating the need for separate terminal pins and their associated soldering connections. This integration reduces the number of cohesive connections from multiple solder joints to a single direct electrical path, thereby reducing electrical contact resistance and improving reliability.
2Ease of manufacture
If terminal pins are soldered onto the printed circuit board, then electrical connections are established, but production cost and manufacturing complexity increase
Solution Approach 1:
The patent extracts the terminal pin component from the system and replaces it with an integrated printed circuit board structure. By removing the separate terminal pin element and its associated soldering process, the invention simplifies the manufacturing process and reduces production costs while maintaining all necessary electrical connection functions.
3Power
If power density is increased, then module performance improves, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from single-sided heat dissipation to dual-sided heat dissipation by utilizing both the upper and lower surfaces of the printed circuit board. The thick lower metallization layer serves as a heat spreader on the bottom side, allowing heat to be dissipated from both the top and bottom of the module. This dimensional change in heat dissipation architecture effectively doubles the heat dissipation capacity, enabling the module to handle higher power densities without excessive temperature rise.
4Quantity of substance
If thick conductor layers are used in the printed circuit board, then high current transfer capability is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent changes the thickness parameter of the lower metallization layer from conventional thin traces to a thick conductor layer with thickness of at least 100 μm. This parameter change enables the conductor layer to function both as an electrical connection and as a heat spreader, achieving high current carrying capacity without requiring multiple complex conductor layers. The single thick layer approach simplifies manufacturing compared to traditional multi-layer PCB designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces electrical resistance, eliminates the need for external terminal pins, and enhances cooling efficiency by allowing heat sinks on both sides of the module, addressing the challenges of contact resistance and heat dissipation in power semiconductor modules.
Implementation Method 1
The first printed circuit board comprises a first thick conductor layer at least partly embedded in the first insulation carrier and which has a thickness of at least 100 μm. The use of such a thick conductor layer makes it possible to transfer high currents within the first printed circuit board.
Implementation Method 2
a further heat sink can be arranged on that side of the first printed circuit board which faces away from the semiconductor chip, thus resulting in efficient cooling of the power semiconductor module on two sides
Implementation Method 3
Instead, in addition to a heat sink on that side of the second printed circuit board which faces away from the power semiconductor chip, a further heat sink can be arranged on that side of the first printed circuit board which faces away from the semiconductor chip
Data Source
AI summary
A power semiconductor module includes a first printed circuit board having a first insulation carrier, and a first upper metallization and a first lower metallization applied to the first insulation carrier on mutually opposite sides, and a second printed circuit board having a second insulation carrier and a second upper metallization applied to the second insulation carrier. The second printed circuit board is spaced apart from the first printed circuit board in a vertical direction oriented perpendicular to the opposite sides of the first insulation carrier. A semiconductor chip is disposed between the printed circuit boards and electrically conductively connected at least to the second upper metallization. The first lower metallization and the second upper metallization face one another. The first printed circuit board has a first thick conductor layer at least partly embedded in the first insulation carrier and which has a thickness of at least 100 μm.