Semiconductor Carrier via Molded Through Contacts
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Solution Overview
Problem
The production of semiconductor components with electrical contacts at the wafer level is complex and costly, requiring intricate processes for forming contacts and stabilizing the semiconductor chip within a carrier.
Innovation Solution
A method involving a semiconductor layer stack with exposed connection layers of different polarities, a metal layer for mechanical stabilization, and through contacts formed using conductive materials, which are integrated into a molded body to create a continuous carrier for mechanical reinforcement and electrical contacting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If through contacts are formed directly on the semiconductor chip at the wafer level, then electrical contacting is achieved, but great technical complexity and high production costs are required
Solution Approach 1:
The patent segments the electrical contacting function into two parts: connection layers formed on the semiconductor chip surface, and through contacts formed separately and mounted onto the connection layers. This segmentation allows each component to be optimized independently, reducing overall production complexity while maintaining reliable electrical contact.
Solution Approach 2:
The connection layers are formed preliminarily on the semiconductor chip surface before the through contacts are created. This preliminary action allows the chip surface preparation to be completed in advance, and the through contacts can be added subsequently through a simpler mounting process, reducing the complexity of the overall manufacturing process.
2Strength
If a carrier is formed to mechanically stabilize the semiconductor chip, then mechanical stability is improved, but the production process becomes more complex
Solution Approach 1:
The patent merges the carrier function with the through contacts by forming the carrier from the same molded body material that encapsulates the through contacts. This combining of functions eliminates the need for a separate carrier component and its associated assembly steps, reducing production process complexity while providing adequate mechanical stability.
Solution Approach 2:
The molded body serving as the carrier performs multiple functions simultaneously: it provides mechanical stability for the semiconductor chip, encapsulates and protects the through contacts, and provides structural support for the entire component. This multi-functionality reduces the number of separate components needed and simplifies the production process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the production of components with high mechanical stability and efficient electrical contacting, reducing complexity and costs by using a combination of coating and molding techniques to form the metal layers and through contacts.
Implementation Method 1
The first metal layer can be deposited onto the semiconductor layer stack by means of a coating method
Implementation Method 2
The molded body material is applied on the composite by hotpressing and is thus secured to the composite and to the through contacts
Data Source
AI summary
A method for producing a component may include providing a composite containing a semiconductor stack layer, a first exposed connection layer and a second exposed connection layer, where the connection layers are arranged on the semiconductor stack, assigned to different electrical polarities and are configured to electrically contact the component to be produced; forming a first through contact exposed in lateral directions on the first connection layer and a second through contact exposed in lateral directions on the second connection layer, where the through contacts are formed from an electrically conductive connection material; and applying a molded body material on the composite for forming a molded body, where each of the through contacts are fully and circumferentially enclosed by the molded body at least in the lateral directions, such that the molded body and the through contacts form a permanently continuous carrier which mechanically carries the component to be produced.