Semiconductor Substrate Molding with Blank Wafer to Suppress Warp
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Solution Overview
Problem
Large semiconductor substrates experience significant warp and breakage during sealing due to high contraction stress of thermosetting epoxy resin, which is exacerbated by the use of fillers to reduce elasticity, compromising heat and moisture resistance.
Innovation Solution
A method using a mold with an upper and lower mold half to integrate substrates with mounted semiconductor devices and blank substrates, applying thermosetting resin under controlled temperature and pressure to suppress warp, allowing for compression, injection, or transfer molding, and using substrates with similar linear expansion coefficients to minimize strain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If filler is charged into the resin up to 95 wt% to reduce elasticity and contraction stress, then contraction stress is reduced, but the resin cannot be sufficiently molded and heat resistance and moisture resistance deteriorate
Solution Approach 1:
The patent changes the chemical composition parameters of the thermosetting resin system by using specific epoxy resins (weight average molecular weight 200-2000) with controlled gel times (5-30 seconds at 150°C) and specific curing agents, achieving optimal balance between contraction stress reduction and moldability without requiring 95 wt% filler content
Solution Approach 2:
The patent creates a composite resin system combining specific epoxy resin base materials with carefully selected curing agents and controlled filler content (30-90 wt%), forming a multi-component composite material that achieves both low contraction stress and good moldability through synergistic material combinations
2Stress or pressure
If filler is charged into the resin up to 95 wt% to reduce elasticity and contraction stress, then contraction stress is reduced, but heat resistance and moisture resistance deteriorate
Solution Approach 1:
The patent optimizes the gel time parameter of the epoxy resin (5-30 seconds at 150°C) and controls the filler content (30-90 wt%) to achieve a balance that maintains heat resistance and moisture resistance while reducing contraction stress, avoiding the 95 wt% filler level that compromises reliability
Solution Approach 2:
The patent develops a composite resin composition with specific epoxy resin-curing agent combinations and controlled filler loading (30-90 wt%), creating a material system that simultaneously achieves low contraction stress and maintained heat/moisture resistance through optimized material composition
3Ease of manufacture
If large substrates are sealed with thermosetting epoxy resin, then sealing is achieved, but the substrate experiences significant warp and breakage due to high contraction stress
Solution Approach 1:
The patent changes the rheological and curing parameters of the resin system by selecting epoxy resins with specific molecular weights and gel times, enabling the resin to flow properly during sealing and cure with minimal contraction stress, thus preventing substrate warp and breakage while maintaining sealing capability
Solution Approach 2:
The patent utilizes the phase transition and flow behavior of the thermosetting resin during the sealing process, controlling the gel time (5-30 seconds at 150°C) to allow the resin to fill and seal the substrate before curing, reducing contraction stress impact on substrate integrity
4Productivity
If collective sealing on wafer level is performed, then productivity is improved, but contraction stress affects larger areas causing increased warp and breakage
Solution Approach 1:
The patent optimizes the resin parameters (molecular weight 200-2000, gel time 5-30 seconds at 150°C) to enable collective sealing of multiple wafers simultaneously while controlling contraction stress through proper curing kinetics, allowing high productivity without compromising substrate integrity across large areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively suppresses warp and breakage of substrates, producing semiconductor apparatuses with excellent heat resistance and moisture resistance, while enabling collective sealing on a wafer level and reducing production costs.
Implementation Method 1
integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin
Implementation Method 2
press the upper mold half and the lower mold half toward each other to perform compression molding of the thermosetting resin
Implementation Method 3
arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200° C.
Data Source
AI summary
A method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, includes: an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200° C., and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted; an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus.