Semiconductor Mounting Device With Integrated Temperature Access
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Solution Overview
Problem
Current mounting devices for semiconductor packages face issues with irregular clamping at varying temperatures, high production costs, improper alignment of semiconductor packages and contact pins, and limited access for temperature supervision, which affect the reliability and efficiency of electronic systems.
Innovation Solution
A mounting device with a bottom side featuring cavities and protrusions for secure positioning and thermal coupling, a top side with holes for contact pins and alignment pins, and openings for temperature sensors, made from low creep plastic materials to provide a reliable and cost-effective solution for heat dissipation and alignment, while allowing direct temperature measurement of semiconductor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional mounting devices like steel clips are used, then mechanical clamping is provided, but access for temperature supervision is obstructed and material costs increase
Solution Approach 1:
The mounting device merges the functions of mechanical clamping and temperature monitoring access into a single integrated structure. The housing itself incorporates openings that provide access to temperature sensors, eliminating the need for separate access mechanisms and reducing material variety while maintaining both clamping functionality and temperature supervision capability
Solution Approach 2:
The mounting device is designed as a multi-functional component that simultaneously provides mechanical clamping of semiconductor packages, structural support, and access pathways for temperature sensors. This universal design consolidates multiple functions into one device, reducing the number of different materials and components needed
2Ease of manufacture
If regular plastic materials are used, then production costs are reduced, but clamping consistency varies at different temperatures
Solution Approach 1:
The patent applies parameter changes by selecting plastic materials with specific thermal and mechanical properties that maintain dimensional stability and clamping force consistency across a wide temperature range. The material parameters are optimized to prevent excessive creep or deformation at elevated temperatures while maintaining cost-effectiveness compared to metal alternatives
3Manufacturing precision
If alignment features are added to the mounting device, then positioning accuracy of semiconductor packages and contact pins is improved, but device complexity increases
Solution Approach 1:
The mounting device incorporates preliminary alignment features such as positioning protrusions and corresponding recesses that pre-align semiconductor packages and contact pins before final assembly. These features are integrated into the housing structure itself, providing accurate positioning without requiring additional separate alignment components or complex adjustment mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures consistent clamping across a wide temperature range, reduces assembly and material costs, improves alignment and thermal coupling, and enables direct temperature monitoring of semiconductor packages, enhancing the reliability and efficiency of electronic systems, especially in high-voltage applications like e-mobility.
Implementation Method 1
The mounting device is made of a resistant low creep plastic material that causes permanent pressure of the power electronic components
Implementation Method 2
a thermal pad can be interposed between the heat dissipation structure and the mounting device for thermal coupling
Implementation Method 3
the protrusion presses the semiconductor package against the thermal pad and the heat dissipation structure to increase thermal coupling
Data Source
AI summary
The present disclosure concerns a mounting device for semiconductor packages, and a heat dissipation assembly with such a mounting device. The mounting device includes a bottom side comprising one or more cavities to house semiconductor packages, and a top side comprising a plurality of holes extending from the bottom side to the top side for accommodating contact pins of the semiconductor packages. A fixation mechanism fixes the mounting device to a heat dissipation structure.