Semiconductor Mounting Structure With Perimeter Wall Overflow Control
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently connecting semiconductor elements to metal substrates with precise application of mounting materials, leading to potential quality issues and size constraints.
Innovation Solution
A semiconductor device design featuring wall-shaped barrier parts and non-barrier regions on the substrate perimeter, allowing mounting material to leak and solidify outside the designated area, reducing the need for precise material adjustment and enabling stable application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If precise application of mounting material is required, then connection quality between semiconductor element and metal substrate is improved, but manufacturing complexity and difficulty increase
Solution Approach 1:
The mounting material is designed to automatically fill the recess and reach the semiconductor element through its own flow properties without requiring external precision control mechanisms. The material self-regulates its distribution to ensure complete coverage and proper connection.
Solution Approach 2:
The mounting material's viscosity and flow characteristics are specifically engineered to change during the mounting process, allowing it to flow into the recess and then stabilize, ensuring reliable connection without requiring complex precision application equipment.
2Loss of substance
If mounting material is precisely contained within the recess, then material waste is reduced, but the risk of insufficient material distribution increases
Solution Approach 1:
The mounting material is applied in a planar form that extends beyond the recess boundaries, utilizing the two-dimensional surface of the substrate to ensure complete coverage of the recess area, thereby preventing insufficient distribution while controlling waste through the defined recess geometry.
3Volume of moving object
If device size is reduced, then integration density is improved, but space for mounting material application is constrained
Solution Approach 1:
The mounting material is contained within a recess that is nested within the substrate structure, allowing the material to be housed within the existing device footprint without requiring additional external space, thus maintaining small device size while facilitating proper material application.
4Manufacturing precision
If barrier parts are added to contain mounting material, then material distribution control is improved, but component count and device complexity increase
Solution Approach 1:
The barrier function is merged with the substrate structure itself through the formation of a recess, eliminating the need for separate barrier components. The substrate's own geometry provides the containment and distribution control functionality, reducing component count while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates stable and high-density mounting of semiconductor elements by ensuring uniform distribution of mounting material, minimizing quality reduction and component count, while allowing for reduced device size.
Implementation Method 1
A portion of the mounting material 30 leaks outside through the non-barrier region 22 and is solidified in plan view
Data Source
AI summary
A semiconductor device 100 includes: a substrate; a mounting material disposed on the substrate; and a semiconductor element disposed on the mounting material. A wall-shaped wall and a non-wall region in which the wall is not provided are formed along a perimeter of the mounting material on the substrate.