Semiconductor Heat Dissipation via Nested Dam and Liquid Metal
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Solution Overview
Problem
Conventional semiconductor devices face challenges in effectively dissipating heat generated by electronic components, which can lead to thermal management issues and device performance degradation.
Innovation Solution
A semiconductor device design that includes a substrate, an electronic component, a cover, a heat conduction component, and a dam, where the heat conduction component is positioned between the electronic component and the cover, and the dam surrounds the heat conduction component to enhance heat dissipation and prevent overflow during reflow processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat conduction component is added to improve heat dissipation, then thermal management performance is improved, but device structure becomes more complex
Solution Approach 1:
The heat conduction component is nested within the semiconductor device package, specifically positioned between the electronic component and the cover. The dam structure is further nested to surround the heat conduction component, creating a compact integrated thermal management solution that improves heat dissipation without proportionally increasing overall device complexity
Solution Approach 2:
The heat conduction component acts as an intermediary element between the heat-generating electronic component and the heat-dissipating cover. This mediator facilitates efficient thermal energy transfer from the electronic component to the cover, resolving the thermal management challenge while maintaining a structured device architecture
2Reliability
If a dam structure is added to prevent heat conduction component overflow, then manufacturing reliability is improved, but device structure becomes more complex
Solution Approach 1:
The dam structure is formed in advance during the manufacturing process, before the heat conduction component is finalized or reflowed. This preliminary structural preparation prevents potential overflow or misalignment of the heat conduction component during subsequent manufacturing steps, thereby improving manufacturing reliability without requiring complex post-assembly adjustments
Solution Approach 2:
The dam is nested within the device structure, surrounding the heat conduction component in a contained manner. This nested configuration provides the necessary structural constraints to prevent overflow while integrating smoothly into the overall device architecture, minimizing the increase in structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat through the use of a high thermal conductivity liquid metal and a structurally reinforced cover, improving thermal management and preventing thermal pollution, thereby enhancing the semiconductor device's performance and reliability.
Implementation Method 1
a heat conduction component disposed between the electronic component and the cover
Implementation Method 2
The semiconductor device includes a liquid metal formed between the cover and the electronic component
Data Source
AI summary
A semiconductor device includes a substrate, an electronic component, a cover, a heat conduction component and a dam. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The heat conduction component is disposed between the electronic component and the cover. The dam is disposed between the electronic component and the cover and surrounds the heat conduction component.