Semiconductor Package Overhang Structure to Prevent Seal Peeling
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Solution Overview
Problem
The undercut shape on the side surface of a single conductor layer in semiconductor devices is unstable, leading to unreliable prevention of sealing member peeling due to its dependence on conductor layer thickness.
Innovation Solution
A semiconductor device configuration with a second conductor layer having an overhang portion protruding from the first conductor layer, and a sealing member portion buried in the space between the overhang and the insulating substrate, stabilizes the undercut shape and enhances the anchor effect to prevent peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an undercut shape is provided on the side surface of a single conductor layer by etching or pressing, then peeling of the sealing member can be prevented by an anchor effect, but the undercut shape is unstable and depends on the thickness of the conductor layer
Solution Approach 1:
The conductor layer is divided into two separate layers: a first conductor layer that maintains electrical connection, and a second conductor layer that forms the overhang portion. This segmentation allows the overhang structure to be created independently of the first conductor layer's thickness, stabilizing the undercut shape while maintaining electrical functionality.
Solution Approach 2:
The solution transitions from creating an undercut shape by modifying the single conductor layer in the vertical dimension to creating an overhang portion by adding a second conductor layer that extends in the horizontal dimension. This dimensional shift allows the overhang to protrude beyond the side end portion of the first conductor layer, providing a stable anchor effect independent of the first conductor layer's thickness.
2Ease of manufacture
If the undercut shape depends on the thickness of the conductor layer, then the manufacturing process is simplified, but the anchor effect becomes unreliable
Solution Approach 1:
By separating the conductor layer into two distinct layers with different functions, the manufacturing process remains relatively simple while achieving reliable anchor effect. The first conductor layer maintains electrical connection and the second conductor layer provides the overhang structure, allowing each layer to be optimized independently for its specific function.
Solution Approach 2:
The second conductor layer is configured with different local properties: it bonds to the first conductor layer in the central region while extending beyond it at the side end portions to form the overhang. This local differentiation allows the structure to provide both electrical connectivity and stable anchor effect without complicating the overall manufacturing process.
Data Source
AI summary
An object of the present disclosure is to provide a technique capable of more reliably preventing peeling of a sealing member. A semiconductor device includes an insulating substrate, a first conductor layer bonded onto the insulating substrate, a second conductor layer, a sealing member, and a semiconductor element. The second conductive layer is bonded onto the first conductor layer and has an overhang portion that is a side end portion protruding in a side direction from a side end portion of the first conductor layer. The sealing member has a portion buried in a space between the overhang portion and the insulating substrate. The semiconductor element is covered with the sealing member.