Semiconductor Package Antenna Integration via Resonant Conductive Pad
Solution Overview
Problem
Conventional semiconductor device packages with separate antennas and communication modules face challenges in compact design due to long RF signal transmission paths, leading to signal quality issues and increased manufacturing costs.
Innovation Solution
A semiconductor device package design that integrates an antenna, conductive pad, and conductive line on a carrier with a resonant structure, where the conductive line is electromagnetically coupled to the antenna through the conductive pad, reducing the dielectric constant between components and improving coupling efficiency without the need for a cavity, thus minimizing package thickness and volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna and communication module are separately manufactured and electrically connected on a circuit board, then each component can be independently optimized, but the transmission path becomes long and signal quality deteriorates
Solution Approach 1:
The patent merges the antenna and communication module into a single integrated package structure. The antenna is disposed over the carrier and spaced from the electrical component (communication module), with a conductive line extending within the carrier to electrically connect them. This integration dramatically shortens the transmission path compared to separate mounting on a circuit board, thereby improving signal quality and reducing transmission losses.
2Ease of manufacture
If the antenna and communication module are separately manufactured, then manufacturing flexibility is maintained, but separate manufacturing costs are incurred and device size cannot be reduced
Solution Approach 1:
The patent combines multiple components (antenna, electrical component, conductive line, and carrier) into a single integrated package. This merging reduces the overall device size and eliminates the need for separate mounting and connection processes that would be required if components were manufactured separately, thereby simplifying the manufacturing process while maintaining design flexibility.
3Reliability
If a conventional connection method is used between antenna and communication module, then electrical connection is achieved, but the package thickness and volume increase
Solution Approach 1:
The patent employs a nested structure where the conductive line is embedded within the carrier, and the antenna is disposed over the carrier in close proximity to the electrical component. This nesting arrangement allows all components to be tightly integrated in a compact volume, minimizing package thickness while maintaining reliable electrical connections between the antenna and communication module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances signal quality and reduces manufacturing costs by integrating the antenna and communication module components on a single carrier with improved electromagnetic coupling, allowing for a more compact and efficient semiconductor device package.
Implementation Method 1
the conductive line is electromagnetically coupled to the antenna through the resonant structure of the conductive pad
Implementation Method 2
the conductive pad includes a resonant structure
Data Source
AI summary
Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. The electrical component is disposed over the top surface of the carrier. The antenna is disposed over the top surface of the carrier and spaced away from the electrical component. The conductive pad is disposed over the top surface of the carrier and beneath the antenna, wherein the conductive pad includes a resonant structure. The conductive line is electrically connected to the electrical component and extends within the carrier. A part of the conductive line is beneath the antenna and the resonant structure of the conductive pad.