Semiconductor Package Conductive Via Adhesive Layer
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Solution Overview
Problem
The manufacturing process of semiconductor package devices is expensive and requires highly accurate alignment and registration techniques, which can be challenging due to the complexity of forming a semiconductor device package with a cavity and redistribution structures.
Innovation Solution
A semiconductor package device is created using a die with a conductive pad and an adhesive layer, encapsulated with a conductive via formed by filling an opening in the adhesive layer, which allows for improved thermal and electrical communication, and a conductive post with a seed layer between the pad and post for enhanced connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a cavity is formed in the carrier to accommodate the semiconductor device, then miniaturization is promoted, but the manufacturing process becomes more complex and expensive
Solution Approach 1:
The patent divides the package structure into distinct functional layers: carrier, adhesive layer, semiconductor device, encapsulant, and redistribution structure. Each layer is formed through separate manufacturing steps, allowing independent optimization and simplifying the overall manufacturing process while achieving miniaturization through the cavity structure.
Solution Approach 2:
The adhesive layer is applied to the carrier surface before the semiconductor device is mounted, and the carrier cavity is prepared in advance. This preliminary preparation of the carrier structure and adhesive application simplifies subsequent assembly steps and reduces manufacturing complexity while enabling compact packaging.
2Adaptability or versatility
If a redistribution structure is formed over the semiconductor device using photolithography or plating techniques, then external connection is enabled, but manufacturing cost increases and highly accurate alignment is required
Solution Approach 1:
The patent introduces a conductive layer within the encapsulant that serves as an intermediary for electrical connections. This conductive layer is formed after encapsulation, eliminating the need for complex pre-alignment photolithography or plating processes. The intermediary conductive path simplifies the manufacturing process while maintaining external connection capability.
Solution Approach 2:
Instead of forming the redistribution structure before encapsulation (which requires high precision alignment), the patent inverts the sequence by forming the conductive connection structure after encapsulation. This reversal of the manufacturing sequence eliminates alignment requirements and simplifies the process while achieving the same electrical connection function.
3Reliability
If the adhesive layer is removed to form openings for conductive vias, then electrical connection is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent combines multiple functions into the encapsulant structure: it provides mechanical protection, thermal management, and serves as the medium for forming conductive vias. The openings in the adhesive layer are formed and filled with conductive material in an integrated process that simultaneously achieves electrical connection and structural integrity, reducing overall manufacturing complexity.
Solution Approach 2:
The encapsulant is designed to serve multiple functions: protecting the semiconductor device, providing thermal pathways, and enabling electrical connections through integrated conductive vias. This multi-functionality consolidates what would otherwise require separate components and processes, simplifying manufacturing while improving electrical connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and improves alignment by using a conductive via and post with seed layers for better thermal and electrical communication, facilitating efficient heat dissipation and electrical connectivity.
Implementation Method 1
a first adhesive layer disposed on the first surface of the first die
Implementation Method 2
a first conductive via disposed in the first adhesive layer and electrically connected to the first die
Implementation Method 3
an encapsulant layer encapsulating the first die and the first adhesive layer
Implementation Method 4
a seed layer disposed between the first conductive pad and the first conductive post
Data Source
AI summary
A semiconductor package device includes a first die having a first surface and a second surface opposite to the first surface, and a first adhesive layer disposed on the first surface of the first die. The semiconductor package device further includes an encapsulant layer encapsulating the first die and the first adhesive layer, and a first conductive via disposed in the first adhesive layer and electrically connected to the first die.