Semiconductor Package Connect Die Routing
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Solution Overview
Problem
Conventional semiconductor packages face issues of high cost, decreased reliability, and large package sizes, which hinder efficient manufacturing and performance.
Innovation Solution
A semiconductor package structure and method that involves receiving and fabricating multiple functional dies and connect dies, with interconnection structures, and mounting them on a carrier with a redistribution structure to enhance electrical connectivity and reduce package size, while using encapsulation and grinding techniques to optimize the package's dimensions and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packaging methods are used, then manufacturing cost is reduced, but reliability decreases and package size increases
Solution Approach 1:
The patent divides the semiconductor package into multiple functional dies (e.g., logic die, memory die, I/O die) that are separately fabricated and then interconnected through a substrate. This segmentation allows each die to be optimized independently for reliability while the overall package size is controlled through integrated routing designs.
Solution Approach 2:
The patent employs three-dimensional packaging architectures where dies are stacked or arranged in multiple layers with vertical interconnections through the substrate. This dimensional transition from planar to spatial arrangement increases routing capacity without proportionally increasing the package footprint, thereby improving reliability while controlling size.
2Ease of manufacture
If conventional semiconductor packaging methods are used, then manufacturing simplicity is maintained, but cost increases
Solution Approach 1:
The patent performs preliminary fabrication of multiple functional dies on separate wafers using standard semiconductor manufacturing processes before assembly. This allows high-volume, cost-effective production of individual dies that can then be efficiently integrated, reducing overall manufacturing cost while maintaining manufacturing simplicity through modular assembly.
Solution Approach 2:
The patent designs a universal substrate structure that can accommodate different types and configurations of functional dies through standardized interconnection interfaces. This multi-functional substrate design enables flexible packaging arrangements without requiring custom manufacturing processes for each configuration, thereby reducing cost while maintaining ease of manufacture.
3Productivity
If conventional semiconductor packaging methods are used, then routing complexity is minimized, but electrical signal routing efficiency decreases
Solution Approach 1:
The patent introduces a substrate as an intermediary component with integrated routing layers that mediate electrical signal transmission between multiple functional dies. This intermediary structure provides dedicated signal paths, power distribution networks, and ground planes that improve routing efficiency while managing complexity through systematic layer design and standardized interconnection schemes.
Data Source
AI summary
A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.