Semiconductor Package With Daisy Chain Measurement Electrodes
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Solution Overview
Problem
Current semiconductor packaging methods lack efficient mechanisms for detecting connection failures between semiconductor chips and substrates, particularly in cases of misalignment or faulty bonding, which can lead to increased costs and reduced reliability.
Innovation Solution
The semiconductor package incorporates normal and measurement connection electrodes and substrate pads arranged in a daisy chain configuration, allowing for the detection of connection failures through current flow analysis, including edge and center measurement electrodes that maintain connectivity even with misalignment, facilitating cost-effective and reliable failure detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional flip chip bonding method is used without measurement electrodes, then the packaging process is simpler, but connection failures and misalignment cannot be detected
Solution Approach 1:
The connection electrodes are segmented into normal connection electrodes (for signal/power transmission) and measurement connection electrodes (for detecting connection status). This segmentation allows independent functionality for each type, enabling failure detection without interfering with normal operation. The measurement electrodes are further divided into edge measurement electrodes and center measurement electrodes to provide comprehensive coverage.
Solution Approach 2:
Measurement substrate pads are introduced as intermediary elements between the measurement connection electrodes and the external testing system. These pads serve as access points for applying test signals and measuring connection status without requiring direct access to the bonded interfaces, thus enabling detection while maintaining package integrity.
2Difficulty of detecting and measuring
If measurement electrodes are added to detect connection failures, then detection capability is improved, but manufacturing cost increases
Solution Approach 1:
The measurement connection electrodes are merged with the normal connection electrode array during the bonding process. Both types of electrodes are formed on the same chip surface and bonded simultaneously to the substrate, utilizing the same bonding equipment and process parameters. This merging approach eliminates the need for separate measurement electrode fabrication steps, thereby reducing manufacturing complexity and cost.
Solution Approach 2:
The measurement substrate pads serve multiple functions: they act as connection points for measurement electrodes, provide access for external testing, and can potentially serve as additional signal pads. This multi-functionality reduces the overall pad count required and simplifies the substrate design, offsetting the cost of adding measurement capabilities.
3Measurement precision
If only center measurement electrodes are used, then the structure is simpler, but edge misalignment cannot be detected
Solution Approach 1:
The measurement electrode system is segmented into edge measurement electrodes positioned at the periphery and center measurement electrodes positioned in the middle region. This spatial segmentation enables detection of misalignment at different locations, with edge electrodes specifically detecting lateral shifts and center electrodes detecting overall bonding quality.
Solution Approach 2:
The measurement coverage is extended from a single center point to a two-dimensional distribution including both edge and center regions. This dimensional expansion of measurement points provides comprehensive coverage of the bonding interface, enabling detection of various types of misalignment that would be invisible to center-only measurement.
Data Source
AI summary
A semiconductor package includes a semiconductor chip with a normal connection electrode and a measurement connection electrode, formed on a first surface, and a substrate with a normal substrate pad, connected to the normal connection electrode, and a measurement substrate pad, connected to the measurement connection electrode. The normal substrate pad and the measurement substrate pad are formed on a surface that faces the first surface. The measurement connection electrode includes first and second edge measurement connection electrodes and first and second center measurement connection electrodes. The measurement substrate pad includes a center measurement substrate pad, a first edge measurement substrate pad, and a second edge measurement substrate pad. The first edge measurement connection electrode and the first center measurement connection electrode are electrically connected to each other, and the second edge measurement connection electrode and the second center measurement connection electrode are electrically connected to each other.