Semiconductor Package Dual Heat Transfer Paths

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Solution Overview

Problem

Semiconductor packages with optical functional elements, such as DMDs, face challenges in dissipating heat generated by the optical functional elements and the window lid, which can lead to performance degradation and potential damage due to increased temperature, especially with higher brightness applications.

Innovation Solution

A semiconductor package design that includes an insulating substrate with first and second heat transfer paths and corresponding heat dissipation units to effectively dissipate heat from both the optical functional element and the window lid, utilizing thermal vias and heat dissipation units to transfer and dissipate heat externally.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the brightness of the light source is increased to improve image quality, then the illumination intensity is improved, but the heat generated by the optical functional element and window lid increases causing performance degradation

Engineering Contradiction:

ImprovebrightnessVSAvoidtemperature of optical functional element and window lid

Core Design Contradiction:

Illumination intensityVSTemperature

Solution Approach 1:

The heat dissipation system is segmented into two independent paths: a first heat transfer path for dissipating heat from the optical functional element, and a second heat transfer path for dissipating heat from the window lid. This segmentation allows each path to be optimized for its specific heat source without interfering with the other, enabling effective heat management at higher brightness levels.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The insulating substrate acts as an intermediary structure that incorporates both heat transfer paths. The substrate includes a first heat transfer path extending from the optical functional element mounting surface and a second heat transfer path extending from the window lid, mediating the heat dissipation process for both components simultaneously.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Temperature

If heat dissipation structures are added to manage thermal issues, then the temperature control is improved, but the device complexity increases

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The insulating substrate merges multiple functions into a single component: it provides electrical insulation, structural support for mounting the optical functional element, and incorporates both the first and second heat transfer paths. This consolidation reduces overall device complexity compared to having separate structures for each function.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The insulating substrate serves as a multi-functional component that simultaneously supports electrical insulation, mechanical mounting, and dual heat dissipation pathways. The first heat transfer path and second heat transfer path are both integrated into the same substrate structure, allowing one component to perform multiple critical functions.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows for simultaneous and effective dissipation of heat from both the optical functional element and the window lid, preventing performance degradation and extending the usable life of the package, while enabling compact, high-brightness, and high-resolution applications like data projectors and rear projection televisions.

Implementation Method 1

a first heat transfer path which transfers heat from the optical functional element to a back surface of the insulating substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a second heat transfer path which transfers heat from the window lid to at least either of the back surface and a side surface of the insulating substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

a first heat dissipation unit which dissipates the transferred heat by the first transfer path and is attached to an end of the first heat transfer path, the end being exposed from the insulating substrate

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 4

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS7768122B2Semiconductor package

Publication Date: 2010.08.03 SHINKO ELECTRIC IND CO LTD

AI summary

A semiconductor package has a substrate having a first heat transfer path for transferring heat from an optical functional element to a back surface of the substrate, a first heat dissipation unit dissipating the transferred heat therefrom, a second heat transfer path for transferring heat generated in an internal cavity and heat from a window lid itself to a back surface and/or a side surface of the substrate, a second heat dissipation unit dissipating the transferred heat therefrom. The heat transfer paths extend through the substrate and have thermal vias.