Semiconductor Package Dual-Side Mounting Terminal Formation
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Solution Overview
Problem
The challenge in miniaturizing semiconductor packages lies in forming external connection terminals when electronic components are mounted on both surfaces of a substrate, as the position for these terminals is not explicit, requiring a method to easily create such terminals.
Innovation Solution
A semiconductor package design featuring a first substrate with mounting electrodes on both surfaces, a second substrate with cavities to accommodate electronic devices and form external connection terminals, and a mold part to seal and protect the components, along with a shield layer to prevent electromagnetic interference, allowing for easy formation of external connection terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If electronic components are mounted on both surfaces of the substrate, then integration is increased, but forming external connection terminals becomes difficult
Solution Approach 1:
The substrate is divided into two separate substrates: a first substrate for mounting electronic components on both surfaces, and a second substrate that provides the external connection terminals. This segmentation allows each substrate to specialize in its function, resolving the contradiction between high integration and easy terminal formation.
Solution Approach 2:
The solution moves from a single-plane mounting approach to a three-dimensional structure where electronic components are mounted on both surfaces of the first substrate, while the second substrate extends in another dimension to provide external connection terminals, effectively utilizing spatial dimensionality to resolve the contradiction.
2Adaptability or versatility
If electronic components are mounted on both surfaces of the substrate, then device functionality is enhanced, but the position for external connection terminals becomes ambiguous
Solution Approach 1:
By segmenting the substrate into two separate substrates with distinct functions, the invention clearly defines where external connection terminals should be located (on the second substrate), eliminating the positional ambiguity that arises when attempting to form terminals on a single substrate with components on both surfaces.
Solution Approach 2:
The second substrate acts as an intermediary between the electronic components mounted on the first substrate and the external connection terminals. This intermediary structure provides a clear, unambiguous location for terminals while maintaining the enhanced functionality of double-sided component mounting.
Data Source
AI summary
There are provided a semiconductor package and a manufacturing method thereof, capable of increasing integration by mounting electronic devices on both surfaces of a substrate. The semiconductor package includes a first substrate having mounting electrodes on both surfaces thereof; a plurality of electronic devices mounted on both surfaces of the first substrate; and a second substrate exposed in cavities and bonded to a bottom surface of the first substrate so as to accommodate the electronic devices mounted on the bottom surface of the first substrate in the cavities.