Semiconductor Package Dummy Electrode Pattern for Fine Wiring
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Solution Overview
Problem
The challenge in semiconductor packaging is the formation of fine circuit lines, which is hindered by undulations in the insulating layer caused by gas and moisture discharge during high-temperature processes, particularly when using liquid photosensitive resin, leading to line width defects and obstacles in forming fine wiring patterns.
Innovation Solution
Incorporating a dummy electrode pattern with holes having a cross-shaped design, where protruding regions reduce the width of the opened region, allowing for efficient gas and moisture discharge while minimizing undulations and maintaining sufficient area, thus preventing line width defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If gas and moisture discharge paths are provided in the insulating layer, then gas and moisture can be discharged smoothly, but the insulating layer develops undulations that obstruct fine circuit line formation
Solution Approach 1:
The discharge path is segmented into multiple sections: the hole region, the first extended region, and the second extended region. This segmentation allows the discharge function to be distributed across different zones, reducing localized undulation impact while maintaining overall gas and moisture discharge capability.
Solution Approach 2:
The discharge path extends in two horizontal dimensions (first and second extended regions) rather than relying solely on vertical depth. This dimensional expansion distributes the discharge function across a larger area, reducing the concentration of stress and undulation in any single location.
2Object-generated harmful factors
If the hole width is increased to provide sufficient discharge area, then gas and moisture discharge is improved, but the undulation of the insulating layer increases
Solution Approach 1:
The total discharge area is segmented into the hole region and two extended regions. This allows the system to achieve sufficient total discharge area while keeping the width of any single section (including the hole) relatively narrow, thereby reducing undulation in the insulating layer.
Solution Approach 2:
Instead of increasing hole width in one dimension, the discharge area is expanded by adding extended regions in horizontal dimensions. This dimensional strategy achieves the required discharge area while maintaining smaller local widths that minimize undulation.
3Manufacturing precision
If liquid photosensitive resin is used to form fine circuits, then smaller and finer circuit lines can be achieved, but gas and moisture discharge becomes more difficult due to the liquid state
Solution Approach 1:
The discharge path (hole and extended regions) is formed in advance within the insulating layer before the liquid photosensitive resin is applied and cured. This preliminary preparation ensures that gas and moisture generated during subsequent curing processes have pre-established escape routes, preventing defects in the fine circuit formation.
Solution Approach 2:
The discharge path structure acts as an intermediary between the liquid photosensitive resin and the external environment. It provides a controlled interface that allows gas and moisture to escape from the liquid resin during curing without disrupting the formation of fine circuit patterns.
Data Source
AI summary
A semiconductor package includes a connection member having a first surface and a second surface disposed to oppose each other and including an insulating member having a plurality of insulating layers and a plurality of redistribution layers disposed on the plurality of insulating layers, respectively; a semiconductor chip disposed on the first surface of the connection member and having connection pads electrically connected to the plurality of redistribution layers; and an encapsulant disposed on the first surface of the connection member and encapsulating the semiconductor chip, wherein at least one of the plurality of redistribution layers includes a dummy electrode pattern in which a plurality of holes are arranged, and each of the plurality of holes has a shape including a plurality of protruding regions that protrude externally from different positions.