Semiconductor Package Bonding With Dummy Pads for Chip Alignment
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Solution Overview
Problem
The increasing demand for compact and high-performance electronic devices requires advanced packaging technologies that integrate multiple semiconductor chips while minimizing size, weight, and the number of adhesive members to prevent defects and improve structural stability in semiconductor packages.
Innovation Solution
A method involving the formation of connection pads, preliminary connection members, and adhesion layers with dummy pads of greater thickness than chip pads, where the adhesion layer is thermally compressed to form connection members, ensuring precise alignment and preventing misalignment between chips, and the adhesion layer is strategically removed to expose surfaces for accurate contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple adhesive members are used to attach semiconductor chips, then the chips can be securely mounted in a single package, but the number of adhesive members increases causing various defects and reducing structural stability
Solution Approach 1:
The patent combines multiple adhesive members into a single adhesive layer that is formed as one continuous structure between the substrate and the semiconductor chip. This single adhesive layer performs the function of multiple discrete adhesive members, reducing the number of components while maintaining secure mounting and structural stability.
Solution Approach 2:
The single adhesive layer serves multiple functions simultaneously: it provides mechanical bonding, fills gaps between the substrate and chip, compensates for misalignment, and prevents defects. This multi-functional approach replaces what would traditionally require multiple specialized adhesive members.
2Ease of manufacture
If adhesive members are used to mount chips, then chips can be attached to the substrate, but misalignment and foreign substances occur reducing manufacturing precision
Solution Approach 1:
The adhesive layer is formed in advance before the semiconductor chip is mounted on the substrate. This preliminary formation of the adhesive layer with its specific thickness and pattern prepares the bonding surface in advance, ensuring precise alignment and preventing misalignment during the chip mounting process.
Solution Approach 2:
The adhesive layer acts as an intermediary substance between the substrate and the semiconductor chip. It mediates the bonding process by providing a controlled interface that prevents direct contact between potentially contaminating surfaces, thereby reducing the occurrence of foreign substances while maintaining manufacturing precision.
3Volume of moving object
If chips are stacked to reduce package size, then compactness is achieved, but the number of adhesive members increases causing defects
Solution Approach 1:
In the stacked chip configuration, the patent combines adhesive members between different chip layers into integrated adhesive layers. Each interface between stacked chips uses a single continuous adhesive layer instead of multiple discrete adhesive members, reducing the total number of adhesive components while maintaining the compact stacked structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the structural stability and reduces defects in semiconductor packages by ensuring precise alignment and contact between chips, while minimizing the occurrence of misalignment and foreign substances, thus improving the overall performance and reliability of the packaged devices.
Implementation Method 1
thermally compressing the adhesion layer against a dummy pad on the second structure; and forming a connection member by thermally compressing the preliminary connection member against a chip pad on the second structure
Data Source
AI summary
A method includes providing a first structure, forming a connection pad on the first structure, forming a preliminary connection member on the connection pad, forming an adhesion layer on the first structure, the adhesion layer covering the preliminary connection member, removing a portion of the adhesion layer to expose an exposure surface of the preliminary connection member, providing a second structure, forming a chip pad and a dummy pad on the second structure, and covering the chip pad and the dummy pad with the adhesion layer that has been formed on the first structure. A thickness of the dummy pad is greater than a thickness of the chip pad.