Semiconductor Package Electrode Corner Extension for Thermal Management
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Solution Overview
Problem
Semiconductor device packages face challenges in effective heat dissipation and limited chip size, particularly in ultraviolet light-emitting elements where internal heat is not efficiently discharged, and there are constraints on chip size in packages of the same dimensions.
Innovation Solution
A semiconductor device package design featuring a body with a cavity, electrodes, and a transparent member, where the electrodes are arranged to increase the chip mounting area and include a heat dissipation pad to enhance heat dissipation efficiency, allowing for larger chips to be manufactured in the same package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional package structure is used, then the package size is compact, but heat dissipation efficiency is poor and chip size is limited
Solution Approach 1:
The patent transitions from a conventional two-dimensional electrode arrangement to a three-dimensional configuration by extending electrodes to corner areas of the package body. This dimensional change increases the chip mounting area and improves heat dissipation efficiency without significantly increasing the overall package footprint, effectively resolving the contradiction between compact size and thermal performance.
Solution Approach 2:
The package structure is segmented into distinct functional zones: corner areas for enhanced heat dissipation and electrode placement, and central areas for other components. This segmentation allows optimized thermal management in critical regions while maintaining overall package compactness, addressing the heat dissipation vs. complexity contradiction.
2Area of stationary object
If the package size is kept the same, then the package remains compact, but the chip size is limited
Solution Approach 1:
The patent utilizes the three-dimensional space within the package by extending electrodes to the corner areas, effectively increasing the chip mounting area without increasing the package's length, width, or height. This dimensional optimization allows larger chips to be mounted in the same package footprint, resolving the contradiction between chip size and package dimensions.
Solution Approach 2:
The electrode structure is nested to extend into the corner areas of the package body, maximizing the use of available space. This nested configuration allows the electrodes to occupy corner regions that would otherwise be unused, thereby increasing the effective chip mounting area within the same package boundaries.
Data Source
AI summary
An embodiment discloses a semiconductor device package, comprising: a body including a cavity; a plurality of electrodes disposed inside the body; a semiconductor device disposed in the cavity of the body; and a transparent member disposed on the cavity, wherein the body comprises: a first side surface and a second side surface facing each other, and a third side surface and a fourth side surface facing each other; a first corner area formed by the first side surface and the third side surface; a second corner area formed by the first side surface and the fourth side surface; a third corner area formed by the second side surface and the fourth side surface; and a fourth corner area formed by the second side surface and the third side surface, and wherein the plurality of electrodes comprises a first electrode on which the semiconductor device is disposed, wherein the first electrode comprises: a fifth side surface and a sixth side surface facing each other; a seventh side surface connecting the fifth side surface and the sixth side surface; a fifth corner area formed by the fifth side surface and the seventh side surface; and a sixth corner area formed by the sixth side surface and the seventh side surface, wherein the fifth corner area is disposed between the second corner area and the third corner area, and the sixth corner area is disposed between the third corner area and the fourth corner area.