Semiconductor Package Device with Exposed Leads for Thermal Management
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Solution Overview
Problem
The high manufacturing cost and poor thermal performance of traditional semiconductor package devices, particularly for power dies, lead to inefficiencies in heat dissipation and power efficiency due to the use of thick leadframes and molding compounds.
Innovation Solution
A semiconductor package device design featuring a leadframe with die paddles and a package body that exposes leads, along with additional heat dissipation elements like metal lids, conductive posts, and metal clips, to enhance thermal management and reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the power die is encapsulated by molding compound, then the die is protected, but thermal performance deteriorates
Solution Approach 1:
The package structure is segmented into distinct functional zones: the molding compound covers only the die and immediate connections for protection, while the leadframe legs and mounting surface remain exposed for heat dissipation. This segmentation allows simultaneous achievement of die protection and thermal management.
Solution Approach 2:
The leadframe acts as an intermediary thermal pathway between the power die and the mounting surface. Heat generated by the die is conducted through the leadframe legs to the exposed mounting surface, providing an efficient heat dissipation route that bypasses the thermally insulating molding compound.
2Power
If thick leadframe and wire are used, then current carrying capacity is improved, but manufacturing cost increases
Solution Approach 1:
The leadframe structure utilizes three-dimensional space efficiently by extending legs vertically from the mounting surface to support the die, and horizontally to provide electrical connections. This spatial arrangement allows adequate current carrying capacity with thinner, more cost-effective leadframe and wire dimensions compared to traditional bulky designs.
3Reliability
If the lead length is increased, then electrical connection is improved, but package body thickness must increase
Solution Approach 1:
The leadframe legs are designed with optimal lengths that extend just sufficient distance from the mounting surface to support the die and provide electrical connections. The lead length is dynamically optimized rather than uniformly increased, ensuring adequate electrical connection without unnecessarily increasing package body thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves power efficiency and reduces manufacturing costs by effectively managing heat dissipation through exposed leads and integrated heat dissipation components, addressing the thermal performance issues of traditional semiconductor package devices.
Implementation Method 1
attaching a first surface of the die to the contact portion
Implementation Method 2
The second surface of the package body is substantially coplanar with the second surface of the first die paddle
Data Source
AI summary
A semiconductor package device includes a leadframe, a first die and a package body. The leadframe includes a first die paddle and a lead. The first die paddle has a first surface and a second surface opposite to the first surface. The first die is disposed on the first surface of the first die paddle. The package body covers the first die and at least a portion of the first surface of the first die paddle and exposing the lead. The package body has a first surface and a second surface opposite to the first surface. The second surface of the package body is substantially coplanar with the second surface of the first die paddle. The lead extends from the second surface of the package body toward the first surface of the package body. A length of the lead is greater than a thickness of the package body.