Semiconductor Package Resin Structure for Heat and Flare Control

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Solution Overview

Problem

In semiconductor devices with organic substrates, material fallout from processed surfaces can lead to image defects, and bonding wires cause light reflection noise, compromising heat dissipation and image quality.

Innovation Solution

A semiconductor device design featuring a substrate with a semiconductor element, a connecting member, a support portion, a first resin portion on the element, and a second resin portion that fills the space between the support and first resin portions to cover the connecting member, enhancing heat dissipation and preventing material fallout and light reflection noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If bonding wires are used to electrically connect the substrate with the semiconductor element, then electrical connection is achieved, but light reflection noise such as flare is generated in captured images

Engineering Contradiction:

Improveelectrical connectionVSAvoidlight reflection noise

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The harmful bonding wires are extracted and removed from the optical path by forming resin portions that cover and bury the bonding wires, eliminating their light reflection while preserving electrical connection functionality

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Resin portions are introduced as intermediary materials to cover the bonding wires, acting as a mediating layer that prevents direct light interaction with the metallic bonding wires while maintaining electrical connectivity

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the organic substrate is subjected to cutting processing or other types of processing, then the substrate can be shaped and mounted, but material falls off from the to-be-processed surface

Engineering Contradiction:

Improvesubstrate processingVSAvoidmaterial fallout

Core Design Contradiction:

Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The resin portions are formed in advance to cover and protect the to-be-processed surfaces of the organic substrate before cutting or other processing operations, preventing material fallout during manufacturing

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The resin portions serve as protective cushioning layers that are applied beforehand to the substrate surfaces, preventing material from falling off during subsequent processing operations

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Temperature

If filler is used to improve heat dissipation, then thermal conductivity is enhanced, but the filler may fall off from the to-be-processed surface

Engineering Contradiction:

Improveheat dissipationVSAvoidfiller fallout

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The resin portions and filler are merged into a single integrated structure, where the resin matrix embeds and secures the filler particles, maintaining thermal conductivity while preventing filler fallout

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

A composite material structure is formed by combining resin and filler, where the resin provides structural integrity and prevents filler particle detachment while the filler maintains thermal dissipation functionality

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively prevents material fallout and light reflection noise, improving heat dissipation and image quality by providing a robust and efficient thermal path and shielding mechanism.

Implementation Method 1

a second resin portion which fills a space between the support portion and the first resin portion and covers the connecting member

Methodology Applied

Scientific EffectLight absorption: Absorption (EM radiation)

Implementation Method 2

from the viewpoint of holding a favorable operation state of the device to obtain a desired characteristic, it is important to dissipate heat generated from the imaging element serving as a heating element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250006755A1Semiconductor device and electronic equipment

Publication Date: 2025.01.02 SONY SEMICON SOLUTIONS CORP

AI summary

According to a semiconductor device, it is possible to obtain a favorable heat dissipation property, prevent falling of a material from a side surface of a substrate, and prevent generation of noise such as a flare caused by light reflected from members being present around a semiconductor element. The semiconductor device includes a substrate, a semiconductor element which is electrically connected to the substrate, a connecting member which electrically connects the substrate with the semiconductor element, a support portion which is provided on the substrate and supports a transparent member being located above the semiconductor element with respect to the substrate, a first resin portion provided on the semiconductor element, and a second resin portion which fills a space between the support portion and the first resin portion and covers the connecting member.