Semiconductor Package Structure With Direct Fluid Die Cooling
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Solution Overview
Problem
Existing semiconductor package structures face challenges in effectively managing heat generated by multiple dies, which degrades performance and reliability, particularly in wafer scale packages.
Innovation Solution
A semiconductor package structure with a metal layer exposing parts of the dies and a temperature controller that includes a circulation region for fluid contact to control die temperature, utilizing a silicon substrate with a mold layer and trenches, and a temperature controller with a columnar body and passage parts for fluid circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal layer completely covers the dies for protection and electrical connection, then reliability and electrical performance are improved, but heat dissipation capability deteriorates
Solution Approach 1:
The metal layer is selectively applied to cover only specific regions of the die surface, leaving other regions exposed. This local differentiation allows the covered regions to benefit from electrical connection and protection while the exposed regions provide heat dissipation pathways, resolving the contradiction between reliability and temperature control.
2Productivity
If wafer scale packaging is used to increase productivity, then manufacturing efficiency is improved, but heat generation from multiple dies worsens thermal management
Solution Approach 1:
The wafer surface is divided into multiple discrete dies, each with its own heat dissipation pathway through the mold layer to the substrate. This segmentation allows heat from individual dies to be managed separately, preventing heat accumulation that would occur in a fully integrated wafer-scale approach, thus enabling high productivity while maintaining thermal control.
3Adaptability or versatility
If multiple dies are mounted in a wafer scale package to increase functionality, then device capability is improved, but heat generation degrades performance
Solution Approach 1:
The mold layer acts as an intermediary thermal management structure between the multiple dies and the substrate. It provides dedicated heat dissipation pathways for each die, allowing the package to accommodate multiple functional dies while maintaining reliable thermal control, thus enabling enhanced functionality without performance degradation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal management by directly controlling die temperatures, improving performance and reliability of the package system.
Implementation Method 1
the fluid in the circulation region being in direct contact with exposed upper sides of the plurality of dies
Implementation Method 2
a circulation region configured to circulate a fluid for controlling the temperature of the plurality of dies
Data Source
AI summary
A semiconductor package structure include a silicon substrate, a plurality of dies on the silicon substrate, a mold layer between the plurality of dies, a metal layer covering an upper side of the mold layer and at least a part of upper sides of each of the plurality of dies, and including an opening that exposes a part of the upper side of at least one die among the plurality of dies, and a temperature controller configured to control a temperature of the plurality of dies, the temperature controller including a body defining a circulation region configured to circulate a fluid for controlling the temperature of the plurality of dies, and a passage part configured to allow the fluid to flow into or out of the circulation region, and the fluid in the circulation region being in direct contact with exposed upper sides of the plurality of dies.