Semiconductor Package Shielding via Conductive Coating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages fail to effectively shield electromagnetic waves, leading to potential malfunctions due to radiation of signals from terminals and wires, as they lack a conductive covering to prevent electromagnetic interference.
Innovation Solution
The semiconductor package incorporates a lead frame with second terminals that can be grounded and a conductive coating covering the molded resin, which are electrically connected to prevent electromagnetic wave leakage, allowing for efficient shielding without the need for additional components like ceramic caps or screws.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a ceramic or metal cap with conductive material is used to shield electromagnetic waves, then electromagnetic wave shielding is improved, but device complexity and manufacturing cost increase due to additional components like fins and screws
Solution Approach 1:
The patent merges the shielding function with the existing molded resin package structure by integrating a conductive coating directly onto the resin surface. This eliminates the need for separate ceramic/metal caps, fins, and screws, thereby reducing structural complexity while maintaining electromagnetic wave shielding effectiveness.
Solution Approach 2:
The molded resin package structure is given multiple functions: it provides mechanical protection, sealing, and electromagnetic wave shielding through the integrated conductive coating. This multi-functionality eliminates the need for dedicated shielding components, simplifying the overall device structure.
2Object-affected harmful factors
If a ceramic or metal cap with conductive material is used to shield electromagnetic waves, then electromagnetic wave shielding is improved, but manufacturing cost increases due to additional components and assembly steps
Solution Approach 1:
The shielding function is combined with the standard package manufacturing process by applying conductive coating during the molding or post-molding stage. This integration eliminates the need for separate shielding component fabrication and assembly steps, thereby reducing manufacturing cost.
Solution Approach 2:
The conductive coating is applied to the molded resin surface during or immediately after the molding process, before final assembly. This preliminary action incorporates the shielding function into the base manufacturing flow, avoiding additional manufacturing steps and reducing overall production cost.
3Productivity
If the package size is reduced, then productivity and integration are improved, but heat radiation capability may deteriorate
Solution Approach 1:
The patent applies local quality by providing thermal interface features (such as thermally conductive regions or heat dissipation structures) at specific locations on the package where heat generation occurs, while maintaining overall compact dimensions. This allows effective heat management in a downsized package configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively shields electromagnetic waves, enhances heat radiation properties, and allows for downsizing of the package while maintaining cost-effectiveness, reducing the risk of malfunctions and eliminating the need for additional mounting components.
Implementation Method 1
a conductive coating 7 covering the molded resin 6 and having an electrical connection to the second terminal 4. In this semiconductor package, part of signals input or output to/from the IC chip 1 may be radiated from the terminal and the wires as electromagnetic waves. Therefore, a second terminal 4 disposed to surround the first terminals 3 on a package plane and capable of being grounded, and a conductive coating 7 covering the molded resin 6 and having an electrical connection to the second terminal 4 are provided.
Data Source
Figure 1
Figure 2A~2C
Figure 3A~3D
AI summary
A lead frame includes: a second terminal that is disposed to surround terminals on a package plane and can be grounded; and a conductive member that covers molded resin and is electrically connected to the second terminal.