Semiconductor Package Heat-Blocking Structure
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Solution Overview
Problem
Semiconductor devices face performance degradation due to insufficient heat dissipation, leading to increased temperatures and reduced efficiency as heat energy generated increases with improved electronic product performance.
Innovation Solution
A semiconductor package design incorporating a heat-blocking structure with voids in the adhesion part between the substrate and semiconductor chips, which effectively blocks heat transmission from a first semiconductor package to a second package, using materials like Teflon with low heat conductivity to minimize temperature rise and performance degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor devices are designed with improved performance, then electronic product performance is improved, but heat energy generated increases leading to temperature rise and performance degradation
Solution Approach 1:
The substrate is divided into a heat generation region (first region) and a non-heat generation region (second region), with different structural configurations in each region. The first semiconductor package is disposed on the heat generation region while the second semiconductor package is disposed on the non-heat generation region, allowing differential heat management strategies for different functional areas.
Solution Approach 2:
Different regions of the substrate are assigned different thermal properties through the heat-blocking structure. The heat-blocking structure is specifically positioned between the substrate and the second semiconductor package in the non-heat generation region, creating localized thermal insulation where needed while maintaining heat dissipation paths in the heat generation region.
2Temperature
If heat dissipation is increased to maintain performance, then temperature control is improved, but heat transmission to adjacent packages increases causing performance degradation
Solution Approach 1:
A heat-blocking structure is introduced as an intermediary element between the substrate and the second semiconductor package. This structure acts as a thermal barrier that selectively blocks heat transmission from the first semiconductor package to the second semiconductor package, while still allowing the second semiconductor package to maintain its own heat dissipation capabilities.
Solution Approach 2:
The heat-blocking function is extracted as a separate structural element (heat-blocking structure) rather than being integrated into the semiconductor packages themselves. This heat-blocking structure is disposed between the substrate and the second semiconductor package, independently managing heat transmission without interfering with the internal thermal management of the packages.
3Reliability
If a heat-blocking structure is introduced to block heat transmission, then performance degradation is prevented, but device complexity increases
Solution Approach 1:
The heat-blocking structure serves multiple functions simultaneously: it blocks heat transmission from the first semiconductor package to the second semiconductor package, provides structural support between layers, and maintains the mechanical integrity of the stacked package configuration. This multi-functionality reduces the need for additional separate components.
Solution Approach 2:
The heat-blocking structure is integrated into the substrate layer structure rather than being added as a separate external component. By combining the heat-blocking function with the existing substrate and adhesion layer architecture, the overall device complexity is minimized while achieving the desired thermal management效果.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat-blocking structure effectively reduces temperature differences between regions of the semiconductor package, preventing performance degradation by efficiently blocking heat generated from the first semiconductor package, thereby maintaining the performance of the semiconductor device.
Implementation Method 1
Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate may be blocked by the heat-blocking structure
Implementation Method 2
a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate may be blocked by the heat-blocking structure
Data Source
AI summary
A semiconductor device includes a substrate, a first semiconductor package disposed on the substrate, and a second semiconductor package spaced apart from the first semiconductor package on the substrate. The second semiconductor package includes a semiconductor chip stacked on the substrate, an adhesion part covering the semiconductor chip, and a heat-blocking structure disposed between the substrate and the semiconductor chip. Heat generated from the first semiconductor package and transmitted to the second semiconductor package through the substrate is blocked by the heat-blocking structure.