Semiconductor Package Heat Dissipation Structure for Optical Alignment
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Solution Overview
Problem
Existing semiconductor device packages face challenges in achieving high accuracy and cost-effectiveness, particularly in the assembly of optical and power modules, which often result in larger and more expensive devices.
Innovation Solution
A semiconductor device package design that incorporates a substrate with a heat dissipation structure, including a housing with a light-emitting device and optical components, and a second optical module with a detector module and a lid extension for improved alignment and reduced optical misalignment, facilitating efficient heat dissipation and module integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional assembly methods are used for optical and power modules, then manufacturing cost and device size are reduced, but assembly accuracy and optical alignment precision deteriorate
Solution Approach 1:
The patent combines the optical module and power module into a single integrated semiconductor device package. The optical component and light-emitting device are disposed in close proximity within the same package, eliminating the need for separate assembly processes and reducing overall device size while maintaining high assembly accuracy through integrated manufacturing.
Solution Approach 2:
The patent employs a nested structure where the optical component is positioned within the housing that also contains the light-emitting device. The detector module is nested within the semiconductor device package, with the lid extending to contact the detector module, creating a compact nested arrangement that improves assembly accuracy without significantly increasing device footprint.
2Manufacturing precision
If traditional assembly methods are used for optical and power modules, then manufacturing cost is reduced, but assembly accuracy and optical alignment precision deteriorate
Solution Approach 1:
By merging the optical and power modules into a single integrated package, the patent enables simultaneous manufacturing of both modules with precise optical alignment built into the manufacturing process. This eliminates the need for costly post-assembly optical alignment procedures, thereby improving optical alignment precision while maintaining cost-effectiveness through streamlined manufacturing.
3Volume of stationary object
If modules are integrated closer together, then device size is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent extracts the heat dissipation function as a separate, dedicated component within the integrated package. The heat dissipation structure is disposed on the substrate and works independently to manage thermal loads from both the optical and power modules, allowing close integration of modules without compromising heat dissipation performance.
4Manufacturing precision
If assembly accuracy is improved through precise alignment, then optical performance is enhanced, but manufacturing complexity and cost increase
Solution Approach 1:
The patent implements preliminary alignment features during the manufacturing process, such as pre-positioned mounting structures and integrated housing designs that guide component placement. The lid extension portion is pre-formed to contact the detector module at a predetermined position, ensuring accurate assembly without requiring complex post-assembly adjustment procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the accuracy and cost-effectiveness of semiconductor device packages by improving heat dissipation and minimizing optical misalignment, leading to more reliable and efficient performance in applications like virtual reality and augmented reality.
Implementation Method 1
a heat dissipation structure disposed on the substrate
Implementation Method 2
a light-emitting device disposed in the housing and capable of emitting light toward the first optical component
Data Source
AI summary
A semiconductor device package includes a substrate, a heat dissipation structure disposed on the substrate, and a first optical module disposed on the heat dissipation structure. The heat dissipation structure includes a housing, an optical component disposed on the housing, and a light-emitting device disposed in the housing and capable of emitting light toward the first optical component.