Semiconductor Package Thermal Structure With Thermoelectric Heat Recovery
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Solution Overview
Problem
As semiconductor components become more densely integrated, heat dissipation becomes a significant challenge, particularly in high-power packages, leading to inefficiencies in thermal management and increased energy consumption.
Innovation Solution
Utilizing thermoelectric generators (TEGs) to convert waste heat from high-power packages into electrical power, which is then used to operate thermal management components like cooling fans for low-power packages, combined with structures such as vapor chambers and liquid cooling systems for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor components are densely integrated to increase integration density, then more components can be integrated into a given area, but heat dissipation becomes a significant challenge leading to thermal management inefficiencies
Solution Approach 1:
The patent converts waste heat, which is a harmful byproduct of high-power packages, into useful electrical energy through thermoelectric generators. This generated electricity is then used to power thermal management components such as cooling fans for low-power packages, thereby transforming the harmful heat into a beneficial resource that improves overall thermal management efficiency
Solution Approach 2:
The patent creates a multi-functional thermal management system where waste heat from high-power packages serves dual purposes: it is both dissipated through liquid cooling systems and converted into electrical power. This electrical power is then used to drive thermal management components for low-power packages, making the heat dissipation system serve multiple functions simultaneously
2Temperature
If conventional thermal management systems are used for high-power packages, then heat dissipation can be achieved, but energy consumption increases due to separate cooling requirements
Solution Approach 1:
The patent implements a self-service thermal management approach where high-power packages generate their own cooling power through thermoelectric generators. The waste heat from these packages is converted into electrical energy that autonomously powers the thermal management components, reducing the need for external energy sources and lowering overall energy consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces energy consumption and cost by converting waste heat into electricity to power thermal management components, improving the overall efficiency of heat dissipation across varying power packages.
Implementation Method 1
thermoelectric generators (TEGs) to convert waste heat from high-power packages into electrical power
Implementation Method 2
liquid cooling systems for efficient heat dissipation
Data Source
AI summary
A package structure includes a high-power package attached to a substrate; a first low-power package attached to the substrate; a first heat dissipation device attached to the first low-power package; a liquid cooling system attached to the high-power package; and a thermoelectric system sandwiched between the high-power package and the liquid cooling system, wherein the thermoelectric system is electrically connected to the first heat dissipation device, wherein the thermoelectric system provides the first heat dissipation device with electrical power during operation of the high-power package.