Semiconductor Package Heat Sink Stepped Portion
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Solution Overview
Problem
Semiconductor packages face challenges in efficiently dissipating heat generated by semiconductor chips, particularly in thin and lightweight designs, which affects operational reliability and productivity during manufacturing.
Innovation Solution
A semiconductor package design incorporating a semiconductor chip, a redistribution layer, an external connection terminal, a sealing material, an adhesive film, and a heat sink with a stepped portion, which enhances heat dissipation and facilitates easy cutting into individual packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is mounted on a semiconductor package to dissipate heat, then heat dissipation performance is improved, but the device complexity increases
Solution Approach 1:
The heat sink is integrated with the semiconductor package structure by mounting it on the back surface of the semiconductor chip, combining the heat dissipation function with the existing package structure rather than adding a completely separate component
Solution Approach 2:
The heat sink serves multiple functions: it dissipates heat from the semiconductor chip, provides a mounting structure for the semiconductor chip, and can serve as part of the electrical connection structure through its thermal interface
2Weight of moving object
If the semiconductor package is designed to be thin and lightweight, then the weight and size are reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The heat sink is positioned locally at the back surface of the semiconductor chip where heat generation is concentrated, providing targeted heat dissipation in the most critical area rather than distributing heat dissipation structures throughout the entire package
Solution Approach 2:
Heat dissipation is enhanced in the vertical dimension by mounting the heat sink on the back surface of the chip, allowing heat to be dissipated upward away from the substrate rather than only laterally, effectively utilizing the third dimension for thermal management
3Productivity
If multiple semiconductor packages are manufactured together, then productivity is improved, but cutting difficulty increases
Solution Approach 1:
The heat sink structure includes a separation region that divides the heat sink into individual sections corresponding to each semiconductor package, allowing the array of packages to be easily separated by cutting along these pre-defined separation lines
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides excellent heat dissipation performance, improves cutting ease, and increases productivity by reducing the distance between semiconductor chips, while allowing for visual information marking on the heat sink.
Implementation Method 1
a heat sink formed on an upper surface of the adhesive film and having a stepped portion at a periphery thereof
Implementation Method 2
heat dissipation performance to effectively dissipate heat generated by a semiconductor chip
Data Source
AI summary
A semiconductor package according to an exemplary embodiment of the present disclosure may comprise a semiconductor chip comprising a chip pad; a redistribution layer electrically connected to the chip pad of the semiconductor chip; an external connection terminal electrically connected to the redistribution layer; a sealing material covering the semiconductor chip and configured to fix the semiconductor chip and the redistribution layer; an adhesive film positioned on the upper surface of the sealing material; and a heat sink formed on the upper surface of the adhesive film and having a stepped portion at the periphery thereof.