Semiconductor Package Heat Spreader Attachment
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Solution Overview
Problem
Current fan-out semiconductor packages with heat spreaders have inefficient heat dissipation due to the heat spreader being attached to the molding material, and the protective layer removal process for the redistribution layer is time-consuming, often requiring laser operation.
Innovation Solution
A semiconductor package design where the heat spreader is directly attached to the die via a thermal interface material, and a molding layer is formed to encapsulate the die, allowing for better heat dissipation and using a grinding process to remove excess molding material, reducing the need for time-consuming laser operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the heat spreader is attached to the molding material, then the structure is simplified, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The patent segments the heat dissipation path by introducing a distinct heat spreader component separate from the molding material. The heat spreader is positioned between the die and the molding material, creating a dedicated thermal management layer that optimizes heat transfer without requiring structural redesign of the entire package.
Solution Approach 2:
The patent employs composite material structure by combining the heat spreader (made of thermally conductive material) with the molding material (providing mechanical protection). This composite approach allows each material to perform its specialized function - the heat spreader for thermal management and the molding material for structural integrity - thereby resolving the contradiction between structural simplicity and heat dissipation efficiency.
2Reliability
If laser removal is used to remove the protective layer, then the protective layer is effectively removed, but the manufacturing time increases
Solution Approach 1:
The patent replaces the laser-based removal method with a chemical etching process. Instead of using high-energy laser beams to ablate the protective layer, the invention employs chemical solutions that selectively dissolve or etch away the protective layer material, significantly reducing the time required while maintaining effective removal.
Solution Approach 2:
The patent changes the removal mechanism from physical/thermal (laser) to chemical. By altering the fundamental parameter of the removal process from electromagnetic energy to chemical reaction, the manufacturing time is reduced while achieving the same effectiveness in protective layer removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency and streamlines the protective layer removal process, improving manufacturing efficiency by allowing direct heat spreader attachment to the die and using chemical or plasma etching for redistribution layer opening.
Implementation Method 1
The thermal interface material is applied between the heat spreader and the die
Data Source
AI summary
The present disclosure provides a semiconductor package. The semiconductor package includes a redistribution layer, a die, a heat spreader, a thermal interface material and a molding layer. The die is disposed on the redistribution layer. The heat spreader is disposed on the die. The thermal interface material is applied between the heat spreader and the die. The molding layer is formed on the redistribution layer to enclose the die. The present disclosure further provides a method of manufacturing the above semiconductor package.