Semiconductor Package Reinforcement Structure for Thin Impact Resistance
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Solution Overview
Problem
As semiconductor packages become thinner, they are prone to cracks or breakage even under mild impact due to reduced structural integrity.
Innovation Solution
Incorporation of a reinforcement structure with multiple reinforcement parts and a post electrically connected to the wiring, surrounded by a molding member, which enhances the package's durability against compressive, bending, and shear stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the semiconductor package is decreased, then the size of mobile devices can be reduced, but cracks or breakage occur more easily under mild impact
Solution Approach 1:
The patent employs a composite structure combining semiconductor die, re-wiring layers, molding material, and reinforcement structures with different material properties. The reinforcement structure uses materials with higher mechanical strength than the semiconductor die alone, creating a composite package that maintains thin profile while improving impact resistance through material composition rather than increasing overall thickness.
Solution Approach 2:
The package is divided into distinct functional segments: semiconductor die, first re-wiring layer, reinforcement structure, molding member, and second re-wiring layer. The reinforcement structure is further segmented into multiple reinforcement parts spaced apart from each other and from the semiconductor die. This segmentation allows each component to perform its specific function while collectively providing enhanced structural integrity without increasing package thickness.
2Strength
If reinforcement structures are added to improve durability, then resistance to mechanical stress increases, but device complexity increases
Solution Approach 1:
The reinforcement structure serves multiple functions simultaneously: it provides mechanical reinforcement against impact and stress, acts as a structural support framework, and maintains spacing between components. The post structure similarly serves both electrical connection and mechanical anchoring functions. This multi-functionality reduces the need for separate dedicated components, thereby limiting complexity increase.
Solution Approach 2:
Rather than uniformly reinforcing the entire package, the reinforcement structure applies localized reinforcement at critical stress points and interfaces. The reinforcement parts are strategically positioned between the semiconductor die and molding member, and the post is placed at specific locations for electrical and mechanical support. This localized approach provides necessary strength while minimizing added structural complexity.
Data Source
AI summary
A semiconductor package includes: a first re-wiring layer including a first wiring; a semiconductor die placed on the first re-wiring layer; a post placed on the first re-wiring layer, and spaced apart from the semiconductor die, wherein the post is electrically connected to the first wiring; and a reinforcement structure including a first reinforcement part and a second reinforcement part, wherein the first reinforcement is placed on the first re-wiring layer, and is spaced apart from the semiconductor die and the post such that it is placed between the semiconductor die and the post, and wherein the second reinforcement part protrudes from the first reinforcement part.