Semiconductor package including a heat-dissipation member and a heat-dissipation pipe and semiconductor package module including the same

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Solution Overview

Problem

Existing semiconductor packages face challenges in effectively managing heat dissipation as they become more powerful and compact, leading to potential performance degradation and reduced lifespan due to inadequate heat regulation.

Innovation Solution

Incorporating a heat-dissipation member with a heat-dissipation pipe that includes a thicker edge region on the package substrate, allowing a refrigerant to pass through and partially enclose the semiconductor chip, enhancing heat dissipation by evaporating refrigerant to reduce chip temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat-dissipation member with uniform thickness is used, then the manufacturing process is simple, but the heat dissipation efficiency is insufficient

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat-dissipation member employs varying thickness across different regions: a first thickness in the first region and a second thickness in the second region. This local variation optimizes heat dissipation efficiency in different areas without requiring complete structural redesign, balancing performance improvement with manufacturing feasibility.

Inventive Principle:

Principle #3Local quality

2Temperature

If the heat-dissipation member has varying thickness, then the heat dissipation efficiency is improved, but the manufacturing complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidmanufacturing difficulty

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The varying thickness is implemented in a localized manner with only two distinct thickness regions, which improves heat dissipation while maintaining relatively simple manufacturing processes. The first region has a first thickness and the second region has a second thickness, allowing optimized thermal performance without excessive manufacturing complexity.

Inventive Principle:

Principle #3Local quality

3Temperature

If a heat-dissipation pipe is added to enclose the semiconductor chip, then the heat dissipation performance is enhanced, but the device complexity increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heat-dissipation pipe is nested within the heat-dissipation member, with the pipe positioned in the second region and extending to enclose the semiconductor chip. This nested configuration allows the heat dissipation system to achieve enhanced thermal management while maintaining a compact integrated structure rather than adding separate external components.

Inventive Principle:

Principle #7Nested doll (Nesting)

4Temperature

If the heat-dissipation pipe extends to enclose the semiconductor chip, then the heat dissipation coverage is increased, but the manufacturing precision requirements increase

Engineering Contradiction:

Improveheat dissipation coverageVSAvoidpositioning precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The heat-dissipation pipe is nested within the heat-dissipation member structure, which provides structural support and alignment features that facilitate accurate positioning. The pipe extends to enclose the semiconductor chip while benefiting from the guiding structure of the heat-dissipation member, reducing the need for extremely high external positioning precision.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves heat dissipation characteristics, preventing performance deterioration and extending the lifespan of semiconductor chips by effectively managing heat generated during operation.

Implementation Method 1

enhancing heat dissipation by evaporating refrigerant to reduce chip temperature

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 2

a heat conduction layer disposed on the semiconductor chip, wherein the semiconductor chip and the heat conduction layer are disposed in the cavity

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20250391735A1Semiconductor package including a heat-dissipation member and a heat-dissipation pipe and semiconductor package module including the same

Publication Date: 2025.12.25 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes: a package substrate; a semiconductor chip disposed on the package substrate; and a heat-dissipation member disposed on the package substrate, wherein the heat-dissipation member includes a heat-dissipation pipe. The heat-dissipation member has a first region and a second region. The first region is placed on the semiconductor chip. The second region is placed on an edge region of the package substrate. The first region has a first thickness. The second region has a second thickness. The second thickness is different from the first thickness. The heat-dissipation pipe is provided in the second region and faces at least one side surface of the semiconductor chip.