Semiconductor Package Insulation for UV Light Extraction
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Solution Overview
Problem
UV semiconductor devices face challenges with low light extraction efficiency and ineffective heat dissipation, as well as issues during package cutting that lead to burrs and potential short circuits.
Innovation Solution
A semiconductor device package design featuring a body with a cavity, a semiconductor device, and a light transmission member, where the body includes conductive and insulating parts to enhance heat dissipation and light extraction, and second insulating parts are strategically placed to prevent burrs and short circuits by ensuring insulation between the upper and lower portions of the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional UV semiconductor device packaging is used, then the device structure is simple, but light extraction efficiency is low and heat dissipation is ineffective
Solution Approach 1:
The package body is divided into multiple conductive parts (first conductive part, second conductive part) separated by insulating parts, creating a segmented structure that simultaneously improves heat dissipation pathways and maintains electrical insulation, thereby enhancing light extraction efficiency without complicating the manufacturing process
Solution Approach 2:
Different regions of the package body are assigned different functional properties: conductive parts for heat dissipation, insulating parts for electrical isolation, and specific edge region structures for burr prevention. This localized functional differentiation improves light extraction efficiency while maintaining overall structural simplicity
2Ease of manufacture
If conventional UV semiconductor device packaging is used, then the device structure is simple, but heat dissipation is ineffective
Solution Approach 1:
The package body is segmented into multiple conductive parts with insulating parts between them, creating multiple heat dissipation pathways while maintaining structural simplicity. The first conductive part and second conductive part can dissipate heat independently, improving overall heat dissipation efficiency
Solution Approach 2:
The insulating parts serve as intermediaries between the first and second conductive parts, allowing thermal energy to be transferred through the structure while maintaining electrical insulation. This intermediary structure enables effective heat dissipation without requiring complex cooling systems
3Device complexity
If package cutting is performed without additional insulating parts, then the manufacturing process is simple, but burrs are generated and short circuits may occur
Solution Approach 1:
The second insulating part is pre-installed in the edge region where the lower surface and side surfaces meet before the package cutting process. This preliminary placement of the insulating part prevents burr formation during cutting and ensures proper insulation is already in place, improving manufacturing precision without significantly increasing device complexity
Solution Approach 2:
The second insulating part is strategically positioned to overlap with the stepped portion, converting the potential harm of burr generation during cutting into a benefit by providing a buffer that prevents burrs from causing short circuits. The insulating part transforms a manufacturing defect into an opportunity for improved reliability
4Reliability
If second insulating part is added to prevent burrs and short circuits, then reliability improves, but device complexity increases
Solution Approach 1:
The second insulating part is placed only in the specific edge region where the lower surface and side surfaces meet, rather than throughout the entire device. This localized placement provides necessary insulation and burr prevention while minimizing the increase in device complexity
Solution Approach 2:
The second insulating part serves multiple functions simultaneously: it prevents burr formation during cutting, provides electrical insulation between conductive parts, and overlaps with the stepped portion to enhance structural integrity. This multi-functionality improves reliability without proportionally increasing device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation efficiency, suppresses burr formation during package cutting, and enhances light extraction efficiency while preventing short circuits due to insulation, leading to a more reliable and efficient semiconductor device package.
Implementation Method 1
a light transmission member disposed on the cavity
Implementation Method 2
the body includes a first conductive part and a second conductive part disposed to be spaced apart from each other in a first direction, a first insulating part disposed between the first conductive part and the second conductive part
Data Source
AI summary
Disclosed in an embodiment is a semiconductor device package comprising: a body comprising a cavity; a semiconductor device disposed within the cavity; and a light transmission member disposed on an upper portion of the cavity, wherein the body comprises a first conductive part and a second conductive part disposed to be spaced apart from each other in a first direction, a first insulating part disposed between the first conductive part and the second conductive part, and a second insulating part disclosed in an edge region where a lower surface and side surfaces of the body meet, wherein the cavity comprises a stepped portion on which the light transmission member is disposed, and wherein the second insulating part overlaps with the stepped portion in a vertical direction of the body.