Semiconductor Package With Liquid Coolant and Micro-Rotator
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Solution Overview
Problem
Semiconductor chips face performance and reliability issues due to inadequate heat dissipation, as they become smaller and more powerful, with conventional thermal dissipation methods either increasing size or compromising performance.
Innovation Solution
Incorporating a non-curing thermal conductive liquid coolant with nanometer-sized particles and a micro-rotator within a semiconductor package, which circulates the coolant to enhance heat dissipation without increasing size or sacrificing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal dissipation methods are used, then heat dissipation is achieved, but the size of semiconductor packages increases
Solution Approach 1:
The patent employs a liquid coolant system to transfer heat away from the semiconductor device. The coolant circulates through channels in contact with the heat-generating components, efficiently removing heat without requiring additional external heat sinks or thermal management hardware that would increase package volume.
Solution Approach 2:
The coolant channels are integrated directly within the semiconductor package structure, nesting the thermal management system within the existing package architecture. This eliminates the need for separate external cooling components and maintains compact package dimensions while achieving effective heat dissipation.
2Power
If higher power components are used, then performance is improved, but heat generation increases
Solution Approach 1:
The liquid coolant system provides active thermal management that scales with power consumption. As higher power components generate more heat, the circulating coolant continuously removes excess thermal energy, maintaining operational temperatures within safe limits and enabling sustained high-performance operation.
Solution Approach 2:
The coolant circulation operates continuously to maintain thermal equilibrium. This continuous active cooling ensures that heat generation from high-power components is immediately counterbalanced, allowing the semiconductor device to sustain elevated power levels without thermal runaway or performance degradation.
3Volume of moving object
If smaller and thinner packages are used, then size demands are met, but thermal dissipation becomes inadequate
Solution Approach 1:
The liquid coolant system delivers high thermal management efficiency within the constrained volume of smaller packages. The fluid's high heat capacity and thermal conductivity enable effective heat removal from compact heat-generating components, achieving adequate thermal dissipation without requiring increased package volume.
Solution Approach 2:
The patent transitions from conventional planar heat dissipation approaches to three-dimensional thermal management by implementing vertical coolant channels and multi-layer cooling structures. This dimensional approach maximizes heat transfer surface area within the limited package footprint, enabling effective thermal dissipation in smaller and thinner form factors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively and efficiently dissipates heat, maintaining or reducing the size of semiconductor packages while improving thermal performance and lowering operating temperatures.
Implementation Method 1
A non-curing thermal conductive liquid coolant substantially fills the volume... effectively and efficiently dissipate heat
Implementation Method 2
a micro-rotator that causes the non-curing thermal conductive liquid coolant to circulate or move within the volume
Implementation Method 3
The non-curing thermal conductive liquid coolant may include nanometer-sized particles that enhance the heat dissipation properties
Data Source
AI summary
A semiconductor package includes a flip chip die communicatively coupled to a substrate. A lid is also coupled to the substrate and covers the flip chip die. A non-curing thermal conductive liquid coolant fills a volume defined by the lid and is used to dissipate heat that is generated by the flip chip die. The non-curing thermal conductive liquid coolant may include nanometer-sized particles that enhance the heat dissipation properties of the non-curing thermal conductive liquid coolant. The semiconductor package also may include a micro-rotator that causes the non-curing thermal conductive liquid coolant to circulate within the volume when a temperature of the flip chip die exceeds a temperature threshold.