Semiconductor Package Assembly With Direct Metal Interconnect Layers
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Solution Overview
Problem
Conventional semiconductor package assembly manufacturing techniques are complex, time-consuming, and prone to connectivity failures due to fragile bonds, requiring pre-designed connecting elements and resulting in high RDS(on) characteristics, which limit the performance of leaded/leadless power/MCD packages or power modules.
Innovation Solution
A method involving the formation of semiconductor packages using a lead frame and semiconductor die structures with connection elements formed by depositing and selectively melting metal powder layers, allowing for flexible layer-by-layer construction and elimination of pre-designed components, reducing RDS(on) and enhancing material handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire bonds or clip bonds are used to connect semiconductor die structures to lead frame terminals, then electrical and mechanical connection is achieved, but the process becomes complex, time-consuming, and the bonds remain fragile prone to connectivity failures
Solution Approach 1:
The patent merges the connection element formation with the semiconductor die mounting process by directly forming metal interconnection layers on the semiconductor die surface using sputtering or evaporation, eliminating the need for separate wire bonding or clip bonding steps. This integration reduces manufacturing complexity while creating more reliable direct metal-to-metal connections between the semiconductor die and lead frame terminals
Solution Approach 2:
The patent extracts and eliminates the intermediate connection elements (wire bonds, ribbons, clips) from the manufacturing process. By directly forming metal interconnection layers on the semiconductor die, the process removes the fragile bonding steps that require pre-designed connecting elements, thereby reducing both process complexity and the risk of connectivity failures
2Adaptability or versatility
If pre-designed and pre-manufactured connecting elements are used, then connection functionality is achieved, but manufacturing time increases and flexibility is reduced
Solution Approach 1:
The patent performs preliminary formation of metal interconnection layers directly on the semiconductor die surface during the mounting process itself, rather than requiring pre-manufactured connecting elements. This preliminary action integrates connection element creation into the assembly process, eliminating separate manufacturing and handling steps, thereby reducing manufacturing cycle time while increasing flexibility to adapt to different design requirements
3Reliability
If conventional bonding techniques are used, then connection is achieved, but RDS(on) remains high limiting performance
Solution Approach 1:
The patent changes the fundamental parameter of connection formation from mechanical bonding (wire/clip bonds) to direct metal layer deposition and fusion. By using sputtering or evaporation to create metal interconnection layers that are directly fused to both the semiconductor die and lead frame terminals, the process achieves lower contact resistance and reduced RDS(on) while maintaining manufacturing simplicity through direct deposition techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the manufacturing process, reduces connectivity failures, and lowers RDS(on) by forming connections with a consistent metal layer interface, extending the life span and improving the performance of semiconductor packages.
Implementation Method 1
sub-step i3-2) of selectively melting, with laser light radiation, the layer of the metal powder to form a metal layer
Data Source
AI summary
The present disclosure relates to techniques for manufacturing a semiconductor package assembly, with a semiconductor die structure mounted to a lead frame having terminals and encapsulated with a molding resin, as well as a semiconductor package assembly obtained with these techniques. An object of the present disclosure is to provide a manufacturing technique that results in a leaded/leadless power/MCD package or power module manufactured with less complex and less time-consuming process steps, and the connecting elements being implemented are of a straightforward design with reduced RDS(on) characteristic.