Semiconductor Package Thermal-Enhanced Conformal Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor packages face challenges with electromagnetic interference (EMI) and thermal dissipation as operation speed increases and device size decreases, leading to heat buildup and reduced device reliability and longevity.
Innovation Solution
A semiconductor package design featuring a substrate with a grounding segment, a die encapsulated by a package body, and multiple metal layers for enhanced thermal dissipation and EMI shielding, where the first metal layer is significantly thicker than the second metal layer, providing both thermal dissipation and conformal EMI shielding without compromising device reliability or safety.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If higher clock speeds are used to increase operation speed, then productivity is improved, but electromagnetic emissions intensity increases causing EMI
Solution Approach 1:
The patent converts the harmful electromagnetic emissions generated by high-speed operation into a beneficial shielding solution by implementing a multi-layer metal structure. The first metal layer (thicker) and second metal layer (thin) work together to capture and redirect EMI away from sensitive device regions, transforming the EMI problem into an opportunity for enhanced electromagnetic compatibility through controlled reflection and absorption.
Solution Approach 2:
The patent employs a composite metal layer structure where a first metal layer with greater thickness is combined with a second metal layer of lesser thickness. This composite approach leverages the complementary properties of different metal configurations to achieve superior EMI shielding effectiveness while maintaining thermal dissipation performance, resolving the contradiction between high-speed operation and electromagnetic interference.
2Productivity
If device size is decreased to improve integration density, then productivity is improved, but thermal dissipation becomes more difficult
Solution Approach 1:
The patent addresses thermal management in miniaturized devices by transitioning from planar heat dissipation to three-dimensional thermal pathways. The multi-layer metal structure extends vertically, creating additional thermal conduction paths through the thickness of the metal layers that conduct heat away from the device core, effectively adding a vertical dimension to thermal management in horizontally-constrained spaces.
Solution Approach 2:
The metal layers serve as thermal intermediaries between the heat-generating device components and the surrounding environment. These layers facilitate heat transfer from the high-density integrated circuits to external heat sinks or cooling structures, enabling effective thermal management despite the reduced device size and increased integration density.
3Object-generated harmful factors
If thicker metal layers are used for EMI shielding, then shielding effectiveness is improved, but thermal dissipation is reduced
Solution Approach 1:
The patent applies local quality by differentiating the thickness of metal layers based on their specific functional requirements. The first metal layer has greater thickness optimized for EMI shielding in regions requiring maximum electromagnetic protection, while the second metal layer has lesser thickness sufficient for supplemental shielding while preserving thermal pathways. This localized optimization resolves the contradiction between shielding effectiveness and thermal dissipation.
Solution Approach 2:
The patent segments the EMI shielding function into multiple distinct metal layers with different thicknesses rather than using a single uniform layer. This segmentation allows each layer to be optimized for its specific role: the thicker first layer provides primary EMI protection, while the thinner second layer provides supplemental shielding without significantly impeding heat flow, thereby resolving the trade-off between shielding and thermal management.
4Temperature
If multiple metal layers are added for thermal and EMI management, then thermal dissipation and shielding are improved, but device complexity increases
Solution Approach 1:
The patent implements multi-functionality by designing the metal layers to simultaneously perform both EMI shielding and thermal dissipation functions. The same first and second metal layers that provide electromagnetic protection also serve as thermal conduction pathways, eliminating the need for separate dedicated thermal management structures and reducing overall device complexity despite the multi-layer configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces maximum junction temperatures and thermal resistances, improving both thermal dissipation and EMI shielding capabilities, thereby enhancing the reliability and longevity of semiconductor devices while maintaining cost-effectiveness.
Implementation Method 1
A first metal layer is disposed over the package body and the die
Implementation Method 2
a second metal layer disposed on the first metal layer and the lateral surface of the substrate, and electrically connected to the grounding segment
Data Source
AI summary
The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. The seed layer is disposed on the package body and the first metal layer is disposed on the seed layer. The second metal layer is disposed on the first metal layer and the lateral surface of the substrate. The first metal layer and the second metal layer form an outer metal cap that provides thermal dissipation and electromagnetic interference (EMI) shielding.