Semiconductor Package Thermal Discharge and Shielding via Mold Via Hole
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor packages face challenges in thermal discharge and electromagnetic shielding, leading to potential damage and operational reliability issues due to electromagnetic waves.
Innovation Solution
A semiconductor package design incorporating a first semiconductor chip, an intermediate heat spreader layer, multiple semiconductor chips, a mold layer with electromagnetic shielding and thermal discharge layers, and strategically placed mold via holes to enhance thermal discharge and electromagnetic shielding capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional semiconductor package structure is used, then the device complexity is low, but the thermal discharge characteristics are poor and electromagnetic shielding is insufficient
Solution Approach 1:
The package structure is segmented into distinct functional layers: a mold layer for structural support, an electromagnetic shielding layer for EMI protection, and a thermal discharge layer for heat dissipation. This segmentation allows each layer to specialize in its function, improving overall reliability while maintaining manageable complexity through modular design.
Solution Approach 2:
The electromagnetic shielding layer and thermal discharge layer are nested within the mold layer structure. The shielding layer is positioned between the mold layer and the semiconductor chip, while the thermal discharge layer extends through the mold layer to the external environment, creating a nested configuration that maximizes space utilization and functional efficiency.
2Object-affected harmful factors
If electromagnetic shielding layer is added, then electromagnetic shielding characteristics improve, but device complexity increases
Solution Approach 1:
The mold layer serves multiple functions: it provides structural support for the semiconductor chip, contains the electromagnetic shielding layer, and facilitates thermal discharge through integrated thermal pathways. This multi-functionality reduces the need for separate dedicated structures, thereby improving electromagnetic shielding without proportionally increasing device complexity.
3Temperature
If thermal discharge layer is added, then thermal discharge characteristics improve, but device complexity increases
Solution Approach 1:
The thermal discharge layer is merged with the electromagnetic shielding layer and mold layer structures. The thermal discharge layer utilizes the same structural pathways and material interfaces as the shielding and mold layers, combining multiple functions into a unified structure that improves heat dissipation without adding separate complex thermal management components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves operational reliability by effectively shielding against electromagnetic interference and facilitating efficient heat dissipation, thereby protecting the semiconductor chips from damage and ensuring reliable operation.
Implementation Method 1
an electromagnetic shielding layer on one or more inner surfaces of the mold layer, the electromagnetic shielding layer further on one or more outer surfaces of the mold layer
Implementation Method 2
a thermal discharge layer on the electromagnetic shielding layer in the mold via hole, such that the thermal discharge layer fills the mold via hole
Data Source
AI summary
A semiconductor package may include a first semiconductor chip on and electrically connected to a wiring substrate, an intermediate layer on the first semiconductor chip and covering an entire surface of the first semiconductor chip, a second semiconductor chip on the intermediate layer and electrically connected to the wiring substrate, a mold layer on the wiring substrate and covering the first semiconductor chip and the second semiconductor chip, the mold layer including one or more inner surfaces defining a mold via hole that exposes a portion of a surface of the intermediate layer, an electromagnetic shielding layer on the one or more inner surfaces of the mold layer and further on one or more outer surfaces of the mold layer, and a thermal discharge layer on the electromagnetic shielding layer in the mold via hole, such that the thermal discharge layer fills the mold via hole.