Semiconductor Package Optical Insulation via Opaque Encapsulation
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Solution Overview
Problem
Existing semiconductor packages for optical devices are complex, costly, and require numerous mounting steps due to the need for a specially dimensioned mounting plate and cover, making them difficult to manufacture and connect electrically, while also being larger than the integrated circuit chips they house.
Innovation Solution
A semiconductor package design featuring a transparent support plate with elongate holes for optical elements, encapsulated with an opaque material to create insulation partitions, and electrical connection tracks that extend beyond the semiconductor device for external connections, allowing for simpler and more cost-effective fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a specially dimensioned mounting plate and cover are used to provide optical insulation, then optical insulation is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The mounting plate and cover are merged into a single integrated support plate structure. The support plate simultaneously provides mechanical support, defines optical chambers through integrated elongate holes, and eliminates the need for separate cover components, thereby reducing structural complexity while maintaining optical insulation functionality.
Solution Approach 2:
The support plate performs multiple functions: it serves as the mounting substrate for integrated circuit chips, defines the optical chambers through its elongate holes, provides structural support for the entire package, and enables optical insulation through its opaque material. This multi-functionality eliminates the need for separate specialized components.
2Object-affected harmful factors
If a specially dimensioned mounting plate and cover are used, then optical insulation is achieved, but manufacturing cost increases
Solution Approach 1:
The mounting plate and cover are merged into a single integrated support plate structure. The support plate simultaneously provides mechanical support, defines optical chambers through integrated elongate holes, and eliminates the need for separate cover components, thereby reducing structural complexity while maintaining optical insulation functionality.
Solution Approach 2:
The support plate performs multiple functions: it serves as the mounting substrate for integrated circuit chips, defines the optical chambers through its elongate holes, provides structural support for the entire package, and enables optical insulation through its opaque material. This multi-functionality eliminates the need for separate specialized components.
3Reliability
If numerous mounting steps are used to assemble the package, then proper assembly is achieved, but productivity decreases
Solution Approach 1:
The mounting plate and cover are merged into a single integrated support plate structure. The support plate simultaneously provides mechanical support, defines optical chambers through integrated elongate holes, and eliminates the need for separate cover components, thereby reducing structural complexity while maintaining optical insulation functionality.
Solution Approach 2:
The support plate is pre-formed with integrated elongate holes that define the optical chambers before chip mounting. This preliminary structuring eliminates the need for subsequent complex assembly steps to create chambers or install separate covers, thereby improving manufacturing efficiency while ensuring proper optical insulation.
4Object-affected harmful factors
If the package size is large compared to the integrated circuit chips, then optical insulation is achieved, but device volume increases
Solution Approach 1:
The support plate is segmented with elongate holes that create separate optical chambers for different optical elements. This segmentation provides optical insulation between chambers while using minimal material, thereby achieving optical isolation without requiring a large overall package volume.
Solution Approach 2:
The support plate uses thin opaque structures (the elongate holes and surrounding material) to provide optical insulation between chambers. This thin-film approach achieves optical isolation with minimal volume, avoiding the need for bulky insulation structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design simplifies the manufacturing process, reduces size, and enables efficient optical insulation and electrical connectivity, making it suitable for use in devices like mobile phones as a proximity detector.
Implementation Method 1
a support plate made of a material that can be passed through by a light radiation
Implementation Method 2
an encapsulation block made of an opaque material encapsulating the semiconductor device on said support plate and filling said elongate hole, forming an optical insulation partition between said optical elements
Data Source
AI summary
A semiconductor package includes a transmissive support plate and includes at least one elongate hole. An integrated circuit semiconductor device is mounted on a rear face of the support plate. The semiconductor device includes first and second optical elements oriented towards the rear face of the support plate, where the first and second optical elements are placed on either side of the elongate hole. An encapsulation material made of an opaque material encapsulates the semiconductor device and fills the elongate hole so as to form an optical insulation partition between the first and second optical elements. A cavity is left, however, between each optical element and a rear face of the support plate.