Semiconductor Package Encapsulation for Protected Optical Interfaces

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Solution Overview

Problem

Existing semiconductor package and manufacturing methods fail to adequately protect the optical path of integrated circuit (IC) dies during encapsulation processes, leading to potential damage and reduced reliability.

Innovation Solution

A sacrificial film is used to cover the optical path of IC dies during encapsulation, which is later removed to reveal and protect the optical path, ensuring the integrity of optical signaling and improving signal performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If encapsulation is performed to protect IC dies, then reliability is improved, but the optical path may be damaged during the process

Engineering Contradiction:

ImprovereliabilityVSAvoidoptical path damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A sacrificial film is applied to the optical path of the IC die before encapsulation. This preliminary protective action ensures that during the subsequent encapsulation process, the optical path is shielded from potential damage while still allowing the encapsulant to be formed over the die.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The sacrificial film serves as an intermediary protective layer between the optical path and the encapsulation process. It temporarily occupies the space and provides protection during manufacturing, then is selectively removed afterward to expose the functional optical path without compromising the encapsulated structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a sacrificial film is applied to protect the optical path, then optical path integrity is improved, but device complexity increases

Engineering Contradiction:

Improveoptical path integrityVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The sacrificial film is a temporary, disposable protective layer that is applied during manufacturing and then removed. It serves its protective function only during the encapsulation process and is discarded afterward, avoiding permanent complexity in the final device structure.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The sacrificial film is discarded after serving its protective purpose during encapsulation. Its removal recovers the optical path functionality without leaving residual complexity, as the film is designed to be completely removed after protecting the optical path during the critical manufacturing stage.

Inventive Principle:

Principle #34Discarding and recovering

Data Source

PatentUS20260082997A1Semiconductor package and manufacturing method thereof

Publication Date: 2026.03.19 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package includes a first die and a second die disposed side-by-side, an encapsulant laterally covering the first die and the second die, and an interconnect structure underlying the encapsulant. Each of the first die and the second die includes a front side and a back side opposite to each other. The second die further includes an optical interface at the back side, and a top surface of the back side of the second die and the optical interface are exposed by the encapsulant. The interconnect structure is connected to the front sides of the first and second dies, and the second die is electrically coupled to the first die through the interconnect structure.