Semiconductor Package Brackets for Vertically Stacked Passive Mounting
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Solution Overview
Problem
Existing semiconductor device packages require significant board area and have high manufacturing costs due to the need for separate mounting of passive components and integrated circuits, often using custom assembly parts like copper clips or posts, which also compromise reliability.
Innovation Solution
A semiconductor device package design featuring a package substrate with conductive leads, a semiconductor die, and brackets extending beyond the die, covered by mold compound to expose mounts for passive components, allowing vertical stacking and integration with the die, using aluminum or copper wire brackets and wedge bonding at room temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If passive components and integrated circuits are placed side by side on a package substrate, then board area is reduced, but manufacturing cost increases due to custom assembly parts
Solution Approach 1:
The patent transitions from planar side-by-side placement to vertical stacking by extending brackets upward from the package substrate. This dimensional change allows passive components to be mounted vertically above the semiconductor die, reducing board area while using standard manufacturing processes without custom assembly parts
Solution Approach 2:
The patent introduces brackets as intermediary structures that extend from the package substrate and provide mounting surfaces for passive components. These brackets serve as mediators between the substrate and passive components, enabling vertical integration without requiring custom assembly parts or specialized packaging
2Device complexity
If custom assembly parts like copper clips or posts are used to mount passive components, then vertical integration is achieved, but reliability decreases
Solution Approach 1:
The patent replaces expensive, complex custom assembly parts (copper clips, posts) with simple, standard brackets that can be reliably attached using conventional bonding methods. These brackets are designed to be permanent fixtures integrated into the package structure, eliminating the need for disposable or temporary assembly components
Solution Approach 2:
The patent changes the physical parameters of the mounting structure by using brackets with specific dimensional characteristics (extending upward from the substrate at defined positions). This allows standard bonding processes to be used instead of specialized assembly techniques, improving reliability while maintaining vertical integration
3Area of stationary object
If passive components are vertically stacked on the semiconductor die, then board area is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the package structure into distinct functional zones: the package substrate with semiconductor die at the base, brackets extending upward as intermediate support structures, and passive components mounted on the bracket surfaces. This segmentation allows each element to be manufactured and positioned independently using standard processes, reducing overall manufacturing complexity despite the vertical arrangement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces board area and manufacturing costs while enhancing reliability by integrating passive components vertically with the semiconductor die, maintaining low thermal stress and using established, cost-effective materials and processes.
Implementation Method 1
using aluminum or copper wire brackets and wedge bonding at room temperature
Data Source
AI summary
In a described example, an apparatus includes: a package substrate with conductive leads; a semiconductor die mounted to the package substrate, the semiconductor die having a first thickness; electrical connections coupling bond pads on the semiconductor die to conductive leads on the package substrate; brackets attached to the package substrate spaced from the semiconductor die and extending away from the package substrate to a distance from the package substrate that is greater than the first thickness of the semiconductor die; and mold compound covering the package substrate, the semiconductor die, the brackets, and the semiconductor die to form a semiconductor device package having a board side surface and a top surface opposite the board side surface, and having portions of the brackets exposed from the mold compound on the top surface of the semiconductor device package to form mounts for a passive component.