Semiconductor Package Photosensitive Rib for Pixel-Safe Miniaturization
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Solution Overview
Problem
Conventional glass on chip (GOC) semiconductor packages face challenges in miniaturization due to adhesive resin application, which interferes with pixel areas and limits further size reduction due to considerations of application accuracy, stability, and resin properties.
Innovation Solution
A semiconductor package design incorporating a transparent member, a semiconductor chip with pixels, a photosensitive rib between non-pixel regions and the transparent member, and an interposer, where the photosensitive rib is bonded in a completely cured state, eliminating the need for adhesive resin and optimizing miniaturization by precise molding and optical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive resin is applied to bond the cover glass to the semiconductor chip, then reliable bonding is achieved, but the package size cannot be further reduced due to resin application accuracy requirements and pixel interference
Solution Approach 1:
The patent extracts the adhesive resin application step from the bonding process and replaces it with a photosensitive rib structure that is pre-formed on the cover glass. This eliminates the need for resin application while maintaining bonding reliability and enabling smaller package size.
Solution Approach 2:
The photosensitive rib is pre-formed on the cover glass before mounting to the semiconductor chip. This preliminary formation of the bonding structure eliminates the need for adhesive resin application and allows for precise positioning without interfering with pixel areas.
2Reliability
If a larger bonded portion is secured for adhesive resin application, then application stability is improved, but the package size increases and pixel occupancy decreases
Solution Approach 1:
The patent removes the adhesive resin from the bonding process and replaces it with a photosensitive rib structure that provides both bonding function and precise positioning. This eliminates the trade-off between bonded portion size and pixel occupancy.
Solution Approach 2:
The patent changes the bonding mechanism from adhesive resin-based to photosensitive rib-based, fundamentally altering the parameters of the bonding process. The photosensitive rib can be formed with precise dimensions that do not interfere with pixel areas while maintaining bonding stability.
3Ease of manufacture
If adhesive resin is used for bonding, then ease of manufacture is maintained, but manufacturing precision is limited due to resin spreading and thixotropy
Solution Approach 1:
The patent replaces the mechanical adhesive resin application system with a photosensitive rib formation system that uses photolithography. This substitution enables precise control of the bonding structure dimensions and position, achieving high manufacturing precision while maintaining ease of manufacture through standardized semiconductor fabrication processes.
Solution Approach 2:
The patent changes the physical state and formation method of the bonding material from liquid adhesive resin to solid photosensitive rib formed by photolithography. This parameter change enables precise dimensional control and eliminates issues related to resin spreading and thixotropy.
4Device complexity
If the photosensitive rib is formed in close contact with both the transparent member and semiconductor chip, then adhesive resin becomes unnecessary, but bonding strength must be sufficient without adhesive resin
Solution Approach 1:
The patent merges the bonding function and the structural support function into a single photosensitive rib element. The photosensitive rib is formed to extend from the cover glass to the semiconductor chip, providing both structural support and bonding function without requiring separate adhesive resin.
Solution Approach 2:
The patent uses a composite structure where the photosensitive rib material combines the properties of structural support and adhesion. The photosensitive rib is formed from materials that provide both mechanical strength for bonding and the ability to maintain close contact between the cover glass and semiconductor chip.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates miniaturization of semiconductor packages by precise control of resin placement, suppresses flare and ghost effects, and enhances optical characteristics, while avoiding defects from organic film peeling and resin protrusion.
Implementation Method 1
a photosensitive rib that is a photosensitive resin disposed between a region not corresponding to the pixel in the chip plane and the transparent member
Data Source
AI summary
Miniaturization is facilitated in a semiconductor package provided with pixels. A semiconductor package includes a transparent member, a semiconductor chip, a photosensitive rib, and an interposer. In this semiconductor package, pixels are arranged on a part of a chip plane of the semiconductor chip. The photosensitive rib is a photosensitive resin disposed between a region not corresponding to the pixel in the chip plane of the semiconductor chip and the transparent member. Furthermore, the interposer is electrically connected to the semiconductor chip.