Semiconductor Package Conductive Posts Insulation Body
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor package technologies face challenges in achieving high-density, high-performance electrical connections with fine-pitch structures, particularly in three-dimensional (3D) packages, where existing methods like wire-bond and flip chips are limited by connection length and density.
Innovation Solution
A semiconductor device package is designed with a semiconductor substrate having conductive posts and an insulation body, where the conductive posts are separated by the insulation layer, allowing for improved electrical performance through precise pitch adjustment and insulation material usage, such as passivation materials or polymers, to enhance signal and ground path connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wire-bond or flip chip connections are used to create 3D packages, then electrical connections can be established, but the connection length is longer and the density is lower compared to TSV
Solution Approach 1:
The patent transitions from planar surface connections (wire-bond, flip chip) to three-dimensional through-silicon via connections, utilizing the vertical dimension to pass through the substrate. This dimensional change enables shorter connection paths and higher density by exploiting the Z-axis space within the substrate thickness.
Solution Approach 2:
The insulation bodies are embedded within the semiconductor substrate, with conductive posts nested inside these insulation bodies. This nested structure allows multiple conductive elements to be packed closely together within the substrate volume, increasing connection density while maintaining electrical isolation.
2Productivity
If conductive posts are placed closely together to achieve fine-pitch structure, then connection density increases, but mutual interference between adjacent posts increases
Solution Approach 1:
Insulation bodies made of low-dielectric constant materials are positioned between adjacent conductive posts to serve as electrical intermediaries. These insulation bodies reduce capacitive coupling and mutual interference between closely spaced conductive posts, enabling fine-pitch structures to function reliably.
Solution Approach 2:
The patent changes the dielectric parameter (dielectric constant) of the insulation material to a low value, which reduces the electrical field interaction between adjacent conductive posts. This parameter change allows closer spacing of conductive posts without excessive mutual interference, achieving finer pitch structures.
3Object-generated harmful factors
If insulation material is used to separate conductive posts, then mutual interference is reduced, but the structural complexity increases
Solution Approach 1:
The insulation bodies are integrated directly into the substrate structure during manufacturing, merging the insulation function with the substrate itself. This integration approach reduces overall structural complexity compared to adding separate insulation layers, as the insulation and substrate become a unified structure.
Data Source
AI summary
The present disclosure relates to a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor substrate having a first surface and a second surface opposite the first surface. The semiconductor substrate has a space extending from the second surface to the first surface and an insulation body is disposed in the space. The semiconductor package structure includes conductive posts in the insulation body.