Semiconductor Package Heat Radiator Body Thermal Interface

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Solution Overview

Problem

Semiconductor devices face challenges in efficiently dissipating heat generated by high-performance semiconductor elements, leading to reduced operating speed and potential malfunctions, as existing heat radiation structures are not optimized for effective thermal conductivity and heat transfer.

Innovation Solution

A semiconductor device design featuring a heat radiator body with a housing recess for the semiconductor element, a thermally conductive adhesive agent connecting the heat sink to the radiator body, and a sealing resin that covers the radiator body and semiconductor element, ensuring efficient heat transfer and radiation while preventing adhesive agent deposition on non-conductive surfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesive agent is applied to connect heat sink to heat radiator body, then thermal conductivity and heat transfer efficiency are improved, but adhesive agent may deposit on non-conductive surfaces causing contamination and potential detachment

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidadhesive deposition on non-conductive surfaces

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies adhesive agent selectively only to the heat radiator body surface that contacts the heat sink, while leaving other surfaces untreated. This localized application ensures thermal conductivity at the heat transfer interface without causing adhesive deposition on non-conductive surfaces, resolving the contradiction between heat transfer efficiency and contamination prevention

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent introduces a covering layer (sealing resin) as an intermediary between the adhesive agent and non-conductive surfaces. This covering layer prevents direct contact between the adhesive and non-conductive surfaces, eliminating adhesive deposition while maintaining effective thermal contact between the heat sink and heat radiator body through controlled adhesive application

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If heat sink is thermally connected to heat radiator body through adhesive agent, then heat radiation efficiency is enhanced, but the structure becomes more complex requiring precise adhesive application

Engineering Contradiction:

Improveheat radiation efficiencyVSAvoidadhesive application structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent simplifies the overall structure by applying adhesive agent only where thermally necessary - at the interface between heat radiator body and heat sink. This localized approach enhances heat radiation efficiency through effective thermal connection while avoiding complex adhesive application structures elsewhere in the device

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent combines the functions of thermal conduction and structural bonding into a single adhesive agent application at the heat sink interface. This merging of thermal and mechanical functions simplifies the device structure by eliminating separate thermal interface materials and bonding mechanisms, achieving both heat transfer efficiency and structural integrity

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances heat radiation efficiency by utilizing the adhesive agent effectively as a heat transfer path and prevents adhesive deposition on non-conductive surfaces, thereby improving thermal conductivity and reducing the risk of heat radiator body detachment.

Implementation Method 1

a heat sink which is thermally connected to an upper surface of the heat radiator body through adhesive agent having a thermally conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

various semiconductor devices each having a structure to radiate heat of a semiconductor element to the outside have been proposed

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS9922902B2Semiconductor device and semiconductor package

Publication Date: 2018.03.20 SHINKO ELECTRIC IND CO LTD

AI summary

A semiconductor device includes: a semiconductor element; a heat radiator body having a housing recess wherein a bottom surface of the housing recess is thermally connected to the upper surface of the semiconductor element; a heat sink which is thermally connected to an upper surface of the heat radiator body through adhesive agent; a sealing resin which covers the lower surface and a side surface of the heat radiator body, an inner side surface of the housing recess, and the lower surface and a side surface of the semiconductor element; and a wiring structure body formed on a lower surface of the sealing resin. The sealing resin includes a covering portion having an upper surface which is substantially flush with the bottom surface of the housing recess and covering the side surface of the heat radiator body. The adhesive agent contacts the side surface of the heat radiator body.