Semiconductor Package Resin Recess for Creepage and Heat Dissipation
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Solution Overview
Problem
Existing semiconductor devices face challenges in preventing unintentional shorting between terminals and ensuring effective heat dissipation due to limitations in terminal arrangement and sealing resin design, which affects their reliability and efficiency in surface mounting and heat management.
Innovation Solution
The semiconductor device incorporates a conductive member with specifically arranged terminal portions and a sealing resin featuring a recessed region that increases creepage distance between terminals, along with a design that allows for efficient heat dissipation by exposing the die pad surface for wider heat spread, thereby enhancing dielectric strength and preventing shorting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If terminals are arranged closely to reduce device size, then device compactness is improved, but the risk of unintentional shorting between terminals increases
Solution Approach 1:
The sealing resin introduces a vertical dimension (thickness direction) to increase creepage distance between terminals. By creating a recessed region that extends in the thickness direction and overlaps with the imaginary line connecting terminals, the path for potential arcing or contamination is lengthened without increasing the horizontal footprint of the device, thus maintaining compactness while improving reliability.
Solution Approach 2:
The sealing resin acts as an intermediary barrier between terminals. The recessed region filled with sealing resin material creates a physical and dielectric barrier that prevents direct contact or arcing between terminals, mediating the space between them to eliminate shorting risks while allowing close terminal arrangement.
2Reliability
If sealing resin completely covers terminals for protection, then terminal protection is improved, but heat dissipation from the semiconductor element is worsened
Solution Approach 1:
The sealing resin coverage is applied selectively rather than uniformly. The recessed region provides localized protection only where needed (between terminals and in critical areas), while leaving the die pad portion exposed for heat dissipation. This local differentiation allows simultaneous achievement of terminal protection and effective heat management.
Solution Approach 2:
The sealing resin structure is segmented into different regions: the recessed region that protects terminals and internal structures, and the exposed die pad portion that facilitates heat dissipation. This segmentation allows each region to perform its specific function optimally without interfering with the other.
3Reliability
If creepage distance between terminals is increased to prevent shorting, then dielectric strength is improved, but device footprint is worsened
Solution Approach 1:
The creepage distance is increased by utilizing the vertical dimension (thickness direction) rather than expanding the horizontal footprint. The recessed region extends downward in the thickness direction and overlaps with the terminal connection line, creating a longer creepage path without increasing the device's planar dimensions, thus maintaining compact footprint while improving dielectric strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents unintentional shorting and improves heat dissipation efficiency, ensuring reliable surface mounting and increased dielectric strength by optimizing terminal arrangement and resin design.
Implementation Method 1
a first resin surface of the sealing resin includes a recessed region recessed in the thickness direction toward the second resin surface, and the recessed region overlaps with an imaginary line connecting a first terminal portion and a second terminal portion as viewed in the thickness direction
Implementation Method 2
the die pad portion includes a mounting surface facing in the first sense of the thickness direction on which the semiconductor element is mounted; and an exposed surface facing in the second sense of the thickness direction and exposed from the second resin surface
Data Source
AI summary
A semiconductor device includes a semiconductor element, a conductor, and a sealing resin. The conductor includes a die pad, a first terminal, and a second terminal. The sealing resin covers a portion of the conductor and the semiconductor element. The sealing resin includes first, second, third and fourth resin surfaces. The die pad includes a first-lead obverse surface with the semiconductor element mounted, and a first-lead reverse surface exposed from the second resin surface. The first terminal is bent in a first sense of z direction and exposed from the third resin surface. The second terminal is bent in the first sense of z direction and exposed from the fourth resin surface. The first resin surface includes a recessed region recessed in z direction toward the second resin surface. As viewed in z direction, the recessed region overlaps with an imaginary line connecting the first terminal and the second terminal.