Semiconductor Package Lead Layout for Uniform Resin Filling
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Solution Overview
Problem
The existing semiconductor device design faces issues with insufficient filling of the sealing resin, leading to increased voids and reduced insulation withstand voltage due to uneven resin flow during the formation process, particularly when the area of the first die pad is larger than the second die pad, causing potential electrical breakdown.
Innovation Solution
The semiconductor device is designed with leads that regulate the flow of molten resin during sealing, ensuring even distribution and denser filling by spacing the leads apart from the resin surfaces and using a configuration that allows the resin to spread uniformly over both die pads, thereby minimizing voids and enhancing insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the area of the first die pad is made larger than the second die pad, then the control element can be properly mounted with sufficient space, but the dimension of the first lead covered by sealing resin becomes excessively larger than the second lead, causing uneven resin flow and insufficient filling
Solution Approach 1:
A resin flow regulation member is introduced as an intermediary element between the leads and the sealing resin. This member regulates the flow of molten resin during the sealing process, ensuring that the resin fills the space uniformly despite the area difference between the first and second die pads. The regulation member acts as a mediator that balances the resin distribution, preventing excessive resin accumulation near the larger first die pad while ensuring adequate filling near the smaller second die pad.
2Length of stationary object
If the dimension of the first lead covered by sealing resin is excessively larger than the second lead, then the first lead can accommodate the larger first die pad, but molten resin flows more readily toward the second die pad, resulting in insufficient filling and increased voids
Solution Approach 1:
The resin flow regulation member serves as a mediator that controls and balances the flow of molten resin. By positioning this member appropriately, the resin flow is regulated to prevent preferential flow toward the second die pad, ensuring adequate filling of the sealing resin in all areas. This regulation reduces void formation and maintains the insulation withstand voltage required for reliable device operation.
3Productivity
If insufficient filling of sealing resin occurs, then the resin can be applied quickly, but the proportion of voids within the sealing resin increases, reducing the insulation withstand voltage and risking electrical breakdown
Solution Approach 1:
The resin flow regulation member is a simple structural element that can be integrated into the existing sealing process without significantly complicating the manufacturing steps. It passively regulates resin flow during the molding process, requiring no additional active control mechanisms. This approach maintains production efficiency while ensuring adequate filling and reducing voids, thereby preserving insulation withstand voltage and device reliability.
Data Source
AI summary
A semiconductor device includes a first die pad, a first semiconductor element, a second die pad, a second semiconductor element, a sealing resin, a first lead, a second lead, a third lead, and a fourth lead. The first lead, the second lead, the third lead, and the fourth lead are each spaced apart from the third side and the fourth side of the sealing resin and are exposed externally from either the first side surface or the second side surface of the sealing resin. Viewed in a third direction perpendicular to the first direction and the second directions, an area of the first die pad is larger than an area of the second die pad. Viewed in the third direction, each of the first lead and the third lead is separated away in the first direction from a first virtual line toward a side where the first side surface of the sealing resin is located.