Semiconductor Package With Segmented Die Pads For Isolation
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in accommodating miniaturized microelectronic circuits, as they limit the ultimate footprint of packaged devices, necessitating innovative solutions for supporting advances in processing sciences.
Innovation Solution
A semiconductor package design featuring split die pads with separate supports, allowing for electrical and thermal isolation, and the use of shared bonding rings and wire bonds to connect multiple dice, enabling efficient packaging of multiple dies while maintaining individual isolation and reducing overall package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional semiconductor packaging is used, then the packaging process is simple, but the footprint of the packaged device increases
Solution Approach 1:
The die pad is divided into multiple isolated regions (first die pad region, second die pad region) that are electrically and thermally isolated from each other. This segmentation allows multiple dice to be mounted on the same die pad without electrical interference, reducing the overall footprint while maintaining functional isolation.
Solution Approach 2:
A single die pad structure serves multiple functions by providing both mechanical support for multiple dice and electrical isolation between them. The die pad with isolated regions acts as both a mounting platform and an electrical isolation mechanism, eliminating the need for separate isolation structures.
2Area of stationary object
If multiple dice are packaged together, then the miniaturization is improved, but the electrical isolation between dice becomes challenging
Solution Approach 1:
The die pad is segmented into isolated regions that prevent electrical current from flowing between adjacent dice. The isolation regions act as electrical barriers, ensuring that signals and power remain confined to their respective dice while allowing compact packaging.
Solution Approach 2:
Isolation regions are introduced as intermediary structures between adjacent die pad regions. These regions serve as mediators that physically separate and electrically isolate the mounting areas for different dice, preventing unwanted electrical interactions while maintaining structural integrity.
3Reliability
If separate die pads are used for each die, then the electrical isolation is achieved, but the package area increases
Solution Approach 1:
Multiple die pad regions are merged into a single integrated die pad structure with isolated regions. This combining approach maintains the electrical isolation benefits of separate die pads while achieving the space efficiency of a unified structure, as all isolated regions share common support infrastructure.
Solution Approach 2:
The single die pad with isolated regions performs multiple functions simultaneously: it provides mechanical support for multiple dice, establishes electrical isolation between them, and serves as a unified mounting platform. This multi-functionality eliminates the need for completely separate die pad structures for each die.
4Area of stationary object
If dice are mounted close together, then the footprint is reduced, but the thermal isolation becomes problematic
Solution Approach 1:
The die pad is segmented into thermally isolated regions that prevent heat from one die from transferring to adjacent dice. The isolation regions act as thermal barriers, allowing multiple dice to be mounted in close proximity while maintaining independent thermal management for each die.
Data Source
AI summary
A semiconductor package is provided and methods for bonding wires in the semiconductor package. In one implementation, the semiconductor package includes a lead frame including a first die pad and a second die pad; each die pad is supported by one or more supports and isolated from another; at least first and second dice, a first die being disposed on the first die pad and a second die being disposed on the second die pad; wire bonds in communication with the first and second dice; and an encapsulant adapted to encapsulate the die pads, the dice, the lead frame and the wire bonds.