Semiconductor Package Manufacturing Using Segmented Support Body
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Solution Overview
Problem
Existing semiconductor package manufacturing methods face challenges in reducing the thickness of the resin portion while maintaining surface flatness, as uniform depth removal of the support body is difficult, leading to in-plane variations and poor flatness of the resin covering the semiconductor chip.
Innovation Solution
A semiconductor package manufacturing method involving a supporting body with a first layer stacked on a second layer, where an opening is formed in the first layer to expose the second layer, allowing for the arrangement of a semiconductor chip and the formation of a resin portion and wiring structure, resulting in a thinner package with improved surface flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the support body is partly removed by etching to reduce resin portion thickness, then the package thickness is reduced, but the surface flatness of the resin portion deteriorates due to in-plane variation of concave portion depth
Solution Approach 1:
The support body is divided into two distinct layers: a first layer that is removed after chip mounting, and a second layer that remains to provide a flat surface. This segmentation allows the first layer to enable thin resin formation while the second layer ensures surface flatness, resolving the contradiction between thickness reduction and flatness maintenance.
Solution Approach 2:
The first layer is removed after chip mounting but before resin formation, preparing the surface in advance for thin resin deposition. This preliminary action enables the resin to be formed at minimal thickness while still achieving uniform surface flatness, as the removal is timed to occur before the resin is applied.
2Length of stationary object
If the resin portion thickness is reduced to decrease package thickness, then the package becomes thinner, but the manufacturing precision of the resin surface deteriorates
Solution Approach 1:
By segmenting the support body into removable first layer and retained second layer, the invention creates a prepared substrate that enables thin resin formation with uniform surface. The first layer removal exposes the second layer's flat surface, allowing minimal resin thickness while maintaining surface flatness.
Solution Approach 2:
The second layer of the support body acts as an intermediary between the chip mounting structure and the resin portion. It provides a stable, flat intermediate surface that enables thin resin deposition while ensuring surface flatness, mediating between the conflicting requirements of thinness and flatness.
Data Source
AI summary
According to one embodiment, there is provided a semiconductor package manufacturing method utilizing a support body in which a first layer is stacked on a second layer, the method including: a first step of forming an opening in the first layer to expose the second layer therethrough; a second step of arranging a semiconductor chip on the second layer through the opening; a third step of forming a resin portion on the first layer to cover the semiconductor chip; and a fourth step of forming a wiring structure on the resin portion so as to be electrically connected to the semiconductor chip.