Semiconductor Package Electromagnetic Wave Shield Film
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Solution Overview
Problem
The increasing number of electronic components in portable wireless communication devices, such as mobile phones, generates electromagnetic noise that interferes with the wireless system, and existing solutions like sheet metal shields are bulky, hindering size and thickness reduction.
Innovation Solution
A semiconductor package with an electromagnetic wave shield film formed on the sealing resin and side surfaces, electrically connected to a ground interconnect, which blocks electromagnetic waves without the need for a sheet metal shield, and a method of manufacturing this package involving a substrate with grid-like dicing lines, sealing resin, external connection electrodes, and metal film application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a sheet metal shield is used to block electromagnetic waves, then electromagnetic noise blocking is improved, but device size and thickness increase
Solution Approach 1:
The patent applies a thin film electromagnetic wave shield film (50-200 nm thickness) formed by sputtering or evaporation on the sealing resin layer, replacing the bulky sheet metal shield. This thin film structure effectively blocks electromagnetic waves while occupying minimal space, thus resolving the contradiction between noise blocking effectiveness and device compactness.
Solution Approach 2:
The electromagnetic wave shield film is integrated within the semiconductor package structure itself, nested between the sealing resin layer and the wireless system components. By embedding the shielding function within the existing package layers rather than adding external shields, the patent achieves effective electromagnetic noise blocking without increasing overall device volume.
2Object-affected harmful factors
If a sheet metal shield is used to block electromagnetic waves, then electromagnetic noise blocking is improved, but manufacturing complexity increases
Solution Approach 1:
The electromagnetic wave shield film formation process is merged with the existing semiconductor package manufacturing process. The shield film is deposited in-situ on the sealing resin layer using standard sputtering or evaporation techniques already employed in semiconductor fabrication, eliminating the need for separate shield assembly operations and reducing manufacturing complexity.
Solution Approach 2:
The patent replaces the mechanical assembly of sheet metal shields with a vapor deposition process. Instead of mechanically attaching metal shields to the package, the electromagnetic wave shield film is deposited directly onto the sealing resin layer through sputtering or evaporation, simplifying the manufacturing process and eliminating complex mechanical assembly steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The semiconductor package effectively blocks electromagnetic noise when mounted, preventing interference with wireless systems without increasing device size or thickness, as the electromagnetic wave shield film is grounded, eliminating the need for a sheet metal shield.
Implementation Method 1
an electromagnetic wave shield film for blocking electromagnetic waves, the electromagnetic wave shield film being formed on an upper surface of the layer of sealing resin and side surfaces of the layer of sealing resin and the substrate
Data Source
AI summary
A method of manufacturing a semiconductor package that includes a package substrate preparing step of preparing a package substrate where semiconductor devices are placed in respective areas demarcated by a plurality of grid-like projected dicing lines and sealed by a layer of sealing resin; a protective film covering step of coating external connection electrodes with a liquid resin thereby to form a protective film thereon; a dividing step of cutting the package substrate along the projected dicing lines with a cutting blade; an electromagnetic wave shield film forming step of applying a metal film to an upper surface of the sealing resin on each of the semiconductor packages and side surfaces of each of the semiconductor packages, thereby forming an electromagnetic wave shield film for blocking electromagnetic waves; and a protective film removing step of removing the protective film.