Semiconductor Package Shield Layout for Signal Isolation
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Solution Overview
Problem
Existing semiconductor packages face challenges in improving reliability and electric characteristics due to issues such as electrical interference and structural limitations in the connection between components.
Innovation Solution
A semiconductor package design featuring a first substrate with under-bump patterns and conductive structures, including a third conductive structure between first and second conductive structures, and a second substrate with redistribution patterns, where the third conductive structure is electrically isolated and wider under-bump patterns provide shielding and improved connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conductive structures are placed close to the semiconductor chip for compact design, then device complexity is reduced, but electrical interference increases and reliability deteriorates
Solution Approach 1:
The patent introduces a shield conductive structure positioned between the signal conductive structure and the semiconductor chip. This intermediary element blocks electromagnetic interference from reaching the signal transmission path, thereby maintaining reliability while allowing compact device layout. The shield structure acts as a mediator that protects the signal path without requiring increased spacing between components.
2Reliability
If the number of conductive structures is increased to improve connectivity, then electric characteristics are enhanced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The shield conductive structure serves multiple functions simultaneously: it blocks electromagnetic interference, provides a reference potential plane, and can be integrated with existing ground structures. This multi-functionality allows the patent to enhance electric characteristics without proportionally increasing device complexity, as a single structure achieves multiple objectives that would otherwise require separate components.
3Area of stationary object
If conductive structures are positioned adjacent to each other for space efficiency, then area is reduced, but electrical isolation becomes difficult and interference increases
Solution Approach 1:
The shield conductive structure is positioned adjacent to signal conductive structures without requiring significant spacing. It acts as an intermediary that actively blocks electromagnetic fields, allowing compact positioning while preventing interference. The shield structure's proximity to signal paths enables effective field blocking without consuming excessive package area.
Solution Approach 2:
The patent utilizes the electrical potential parameter by setting the shield conductive structure to a reference potential (ground). This parameter change allows the shield to effectively block electromagnetic interference through potential difference, enabling close positioning of conductive structures while maintaining electrical isolation through potential control rather than physical distance.
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes a first substrate including a first, second and third under-bump patterns; a semiconductor chip provided on the first substrate; conductive structures provided on the first substrate; and a second substrate provided on the semiconductor chip and the conductive structures. The third under-bump pattern is electrically isolated from the first and second under-bump patterns. The conductive structures include: a first conductive structure coupled to the first under-bump pattern; a second conductive structure coupled to the second under-bump pattern; and a third conductive structure coupled to the third under-bump pattern and provided adjacent to the first and second conductive structures. The third conductive structure is provided between the first conductive structure and the second conductive structure, the first under-bump pattern is wider than the third under-bump pattern, and the second under-bump pattern is wider than the third under-bump pattern.